BR25H04ANUX-5ACTR
ActiveRohm Semiconductor
4KBIT, SPI BUS, SERIAL EEPROM FOR AUTOMOTIVE (125℃ OPERATION)
BR25H04ANUX-5ACTR
ActiveRohm Semiconductor
4KBIT, SPI BUS, SERIAL EEPROM FOR AUTOMOTIVE (125℃ OPERATION)
Description
General part information
BR25H04ANUX-5AC Series
BR25H040xxx-5AC Series is a 4Kbit serial EEPROM of SPI BUS Interface.
Technical Specifications
Parameters and characteristics for this part
| Specification | BR25H04ANUX-5ACTR |
|---|---|
| Clock Frequency | 20 MHz |
| Grade | Automotive |
| Memory Depth | 512 |
| Memory Format | EEPROM |
| Memory Interface (Type) | SPI |
| Memory Size | 4 Kbit |
| Memory Type | Non-Volatile |
| Memory Width | 8 bit |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 125 °C |
| Operating Temperature (Min) | -40 °C |
| Package / Case | 8-UFDFN Exposed Pad |
| Package Name | VSON08AX2030 |
| Qualification | AEC-Q100 |
| Technology | EEPROM |
| Voltage - Supply (Maximum) | 5.5 V |
| Voltage - Supply (Minimum) | 1.7 V |
| Write Cycle Time - Page | 3.5 ms |
| Write Cycle Time - Word | 3.5 ms |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Factory Information
Impedance Characteristics of Bypass Capacitor
Design Guide and Example of Stencil for Exposed Pad
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Opcode, Address, and Page Configuration for SPI BUS EEPROM
Solder Joint Rate and Thermal Resistance of Exposed Pad
Five Steps for Successful Thermal Design of IC
BR25H04ANUX-5AC Data Sheet
What Is Thermal Design
VSON08AX2030 Package Information
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
Thermal Resistance
Basics of Thermal Resistance and Heat Dissipation
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)