TDA3681 Series

Part	Current - Supply	Package Length	Package Name	Package Features	Package Width	Voltage - Supply (Maximum)	Voltage - Supply (Minimum)	Applications	Operating Temperature (Min)	Operating Temperature (Max)	Mounting Type	Package / Case
NXP USA Inc. TDA3681TH/N2S,518	110 µA	0.433 in	20-HSOP 20-SOIC	Exposed Pad	11 mm	18 V	9.5 V	Ignition Buffer Regulator	-40 °C	85 °C	Surface Mount
NXP USA Inc. TDA3681TH/N2S/S435	110 µA	0.433 in	20-HSOP 20-SOIC	Exposed Pad	11 mm	18 V	6.5 VDC		-40 °C	85 °C	Surface Mount
NXP USA Inc. TDA3681ATH/N1C,512	110 µA	0.433 in	20-HSOP 20-SOIC	Exposed Pad	11 mm	18 V	9.5 V	Ignition Buffer Regulator	-40 °C	85 °C	Surface Mount
NXP USA Inc. TDA3681J/N2C,112	110 µA		17-PDBS			18 V	9.5 V	Ignition Buffer Regulator	-40 °C	85 °C	Through Hole	17-SIP Formed Leads
NXP USA Inc. TDA3681JR/N2C	110 µA		17-PDBS			18 V	9.5 V	Ignition Buffer Regulator	-40 °C	85 °C	Through Hole	17-SIP Formed Leads
NXP USA Inc. TDA3681ATH/N1S,518	110 µA	0.433 in	20-HSOP 20-SOIC	Exposed Pad	11 mm	18 V	9.5 V	Ignition Buffer Regulator	-40 °C	85 °C	Surface Mount

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