SM750KE160000-AC

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Silicon Motion, Inc.

IC MPU LYNXEXP 300MHZ 265BGA

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Active

Silicon Motion, Inc.

IC MPU LYNXEXP 300MHZ 265BGA

Technical Specifications

Parameters and characteristics for this part

Specification	SM750KE160000-AC

Additional Interfaces	GPIO, SSP, I2C, PCI
Core Processor	LynxExpress
Display & Interface Controllers	TMDS, LVDS, DMA, DVO
Graphics Acceleration	True
Mounting Type	Surface Mount
Number of Cores/Bus Width	1 Core
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Package / Case	265-LFBGA
RAM Controllers	DDR
Speed	300 MHz
Supplier Device Package	265-BGA (17x17)
USB	USB 3.0

Part	Operating Temperature [Max]	Operating Temperature [Min]	Additional Interfaces	Display & Interface Controllers	USB	Speed	Number of Cores/Bus Width	Supplier Device Package	Package / Case	Mounting Type	RAM Controllers	Core Processor
Silicon Motion, Inc. SM750KE160000-AC	85 °C	-40 °C	GPIO I2C PCI SSP	DMA DVO LVDS TMDS	USB 3.0	300 MHz	1 Core	265-BGA (17x17)	265-LFBGA	Surface Mount	DDR	LynxExpress
Silicon Motion, Inc. SM750GE000000-AC	85 °C	-40 °C	GPIO I2C PCI SSP	DMA DVO LVDS TMDS	USB 3.0	300 MHz	1 Core	265-BGA (17x17)	265-LFBGA	Surface Mount	DDR	LynxExpress
Silicon Motion, Inc. SM750GX000000-AC	70 °C	0 °C	GPIO I2C PCI SSP	DMA DVO LVDS TMDS	USB 3.0	300 MHz	1 Core	265-BGA (17x17)	265-LFBGA	Surface Mount	DDR	LynxExpress
Silicon Motion, Inc. SM750GX160001-AC	70 °C	0 °C	GPIO I2C PCI SSP	DMA DVO LVDS TMDS	USB 3.0	300 MHz	1 Core	265-BGA (17x17)	265-LFBGA	Surface Mount	DDR	LynxExpress

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

LynxExpress Microprocessor IC LynxExp 1 Core 300MHz 265-BGA (17x17)

Technical documentation and resources