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DTB523YETL

DTB523YETL

Active
Rohm Semiconductor

PNP, SOT-416, R1≠R2 LEAK ABSORPTION TYPE DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR)

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DTB523YETL

DTB523YETL

Active
Rohm Semiconductor

PNP, SOT-416, R1≠R2 LEAK ABSORPTION TYPE DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR)

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Description

General part information

DTB523 Series

These are the standard products of "digital transistors" which ROHM invented and marketed first in the world.

Technical Specifications

Parameters and characteristics for this part

SpecificationDTB523YETL
Current - Collector (Ic) (Max)500 mA
Current - Collector Cutoff (Max)500 nA
DC Current Gain (hFE) (Min)140
Frequency - Transition260 MHz
Mounting TypeSurface Mount
Package / CaseSOT-416, SC-75
Package NameEMT3
Power - Max150 mW
Resistor - Base (R1) Resistance2.2 kOhm
Resistor - Emitter Base (R2)10 kOhms
Transistor TypePre-Biased, PNP
Vce Saturation (Max)300 mV
Voltage - Collector Emitter Breakdown (Max)12 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Datasheet
Two-Resistor Model for Thermal Simulation
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Package Dimensions
Certificate of not containing SVHC under REACH Regulation
Notes for Temperature Measurement Using Thermocouples
Anti-Whisker formation - Transistors
Moisture Sensitivity Level - Transistors
Basics of Thermal Resistance and Heat Dissipation
Measurement Method and Usage of Thermal Resistance RthJC
Temperature derating method for Safe Operating Area (SOA)
Types and Features of Transistors
What Is Thermal Design
ESD Data
Importance of Probe Calibration When Measuring Power: Deskew
Part Explanation
About Flammability of Materials
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
PCB Layout Thermal Design Guide
Reliability Test Result
Precautions When Measuring the Rear of the Package with a Thermocouple
Explanation for Marking
What is a Thermal Model? (Transistor)
Taping Information
Inner Structure
List of Transistor Package Thermal Resistance
How to Use LTspice® Models
Calculation of Power Dissipation in Switching Circuit
Impedance Characteristics of Bypass Capacitor
Method for Monitoring Switching Waveform
How to Use LTspice® Models: Tips for Improving Convergence
How to Create Symbols for PSpice Models
Condition of Soldering / Land Pattern Reference
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
About Export Regulations
Notes for Calculating Power Consumption:Static Operation
Compliance of the RoHS directive
DTA114EEFRA