UMN10NTR
ActiveRohm Semiconductor
DIODE: SWITCHING; SMD; 80V; 0.1A; 4NS; SOT363; UFMAX: 1.2V; IFSM: 4A
UMN10NTR
ActiveRohm Semiconductor
DIODE: SWITCHING; SMD; 80V; 0.1A; 4NS; SOT363; UFMAX: 1.2V; IFSM: 4A
Description
General part information
UMN10N Series
ROHM's switching diodes, including diode arrays, are available in high-reliability packages and stable supply for various applications.
Technical Specifications
Parameters and characteristics for this part
| Specification | UMN10NTR |
|---|---|
| Current - Average Rectified (Io) (per Diode) | 100 mA |
| Current - Reverse Leakage | 100 nA |
| Diode Configuration | Independent |
| Diode Count | 3 |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction (Max) | 150 °C |
| Package / Case | 6-TSSOP, SC-88, SOT-363 |
| Package Name | UMD6 |
| Reverse Recovery Time (trr) | 4 ns |
| Speed | Any Speed, Small Signal |
| Speed - Fast Recovery (Maximum) | 200 mA |
| Speed - Small Signal Current Max | 200 mA, 200 mA, 200 mA |
| Technology | Standard |
| Voltage - DC Reverse (Vr) (Max) | 80 V |
| Voltage - Forward (Vf) (Max) | 1.2 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Measurement Method and Usage of Thermal Resistance RthJC
Method for Monitoring Switching Waveform
Compliance of the RoHS directive
Basics of Thermal Resistance and Heat Dissipation
How to Use LTspice® Models
What Is Thermal Design
Diode Types and Applications
Precautions When Measuring the Rear of the Package with a Thermocouple
Certificate of not containing SVHC under REACH Regulation
Notes for Temperature Measurement Using Thermocouples
Impedance Characteristics of Bypass Capacitor
What is a Thermal Model? (Diode)
Inner Structure
About Export Regulations
Part Explanation
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
About Flammability of Materials
Absolute Maximum Rating and Electrical Characteristics of Diodes
Anti-Whisker formation - Diodes
How to Use LTspice® Models: Tips for Improving Convergence
PCB Layout Thermal Design Guide
Condition of Soldering / Land Pattern Reference
Explanation for Marking
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Moisture Sensitivity Level - Diodes
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
How to Select Reverse Current Protection Diodes for LDO Regulators
Importance of Probe Calibration When Measuring Power: Deskew
Power Loss and Thermal Design of Diodes
Two-Resistor Model for Thermal Simulation
ESD Data
How to Create Symbols for PSpice Models
Reliability Test Result
List of Diode Package Thermal Resistance
Notes for Calculating Power Consumption:Static Operation
Taping Information
Package Dimensions