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TFM-145-01-S-D-P

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Samtec Inc.

CONN HEADER VERT 90POS 1.27MM

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TFM-145-01-S-D-P

Active
Samtec Inc.

CONN HEADER VERT 90POS 1.27MM

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationTFM-145-01-S-D-P
Connector TypeHeader
Contact Finish - MatingGold
Contact Finish - PostTin
Contact Finish Thickness - Mating30 Áin
Contact Finish Thickness - Mating0.76 Ám
Contact Length - Mating3.33 mm
Contact Length - Mating0.131 in
Contact Length - Post [x]0.078 in
Contact Length - Post [x]1.98 mm
Contact MaterialPhosphor Bronze
Contact ShapeSquare
Contact TypeMale Pin
Current Rating (Amps)2.9 A
Fastening TypePush-Pull
FeaturesPick and Place
Insulation ColorBlack
Insulation Height5.6 mm
Insulation Height0.22 in
Insulation MaterialLiquid Crystal Polymer (LCP)
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions90
Number of Positions LoadedAll
Number of Rows2
Operating Temperature [Max]125 °C
Operating Temperature [Min]-55 °C
Pitch - Mating0.05 in
Pitch - Mating1.27 mm
Row Spacing - Mating0.05 in
Row Spacing - Mating1.27 mm
ShroudingShrouded - 4 Wall
StyleBoard to Board, Cable
TerminationSolder
Voltage Rating275 VAC

TFM-145 Series

PartInsulation MaterialNumber of RowsRow Spacing - MatingRow Spacing - MatingOperating Temperature [Min]Operating Temperature [Max]Fastening TypeTerminationVoltage RatingStyleContact Finish - MatingMounting TypeCurrent Rating (Amps)Contact MaterialNumber of PositionsContact ShapeConnector TypeContact TypeMaterial Flammability RatingPitch - MatingPitch - MatingContact Length - MatingContact Length - MatingFeaturesNumber of Positions LoadedInsulation HeightInsulation HeightContact Finish - PostShroudingContact Finish Thickness - MatingContact Finish Thickness - MatingInsulation ColorContact Length - PostContact Length - PostContact Length - Post [x]Contact Length - Post [x]
Liquid Crystal Polymer (LCP)
2
0.05 in
1.27 mm
-55 °C
125 °C
Push-Pull
Solder
275 VAC
Board to Board
Cable
Gold
Surface Mount
2.9 A
Phosphor Bronze
90
Square
Header
Male Pin
UL94 V-0
0.05 in
1.27 mm
0.139 in
3.53 mm
Board Guide
Pick and Place
All
0.435 in
11.05 mm
Tin
Shrouded - 4 Wall
30 Áin
0.76 Ám
Black
Liquid Crystal Polymer (LCP)
2
0.05 in
1.27 mm
-55 °C
125 °C
Push-Pull
Solder
275 VAC
Board to Board
Cable
Gold
Surface Mount
2.9 A
Phosphor Bronze
90
Square
Header
Male Pin
UL94 V-0
0.05 in
1.27 mm
0.131 in
3.33 mm
Mating Flange
All
0.22 in
5.6 mm
Tin
Shrouded - 4 Wall
15 µin
0.38 µm
Black
Liquid Crystal Polymer (LCP)
2
0.05 in
1.27 mm
-55 °C
125 °C
Push-Pull
Solder
275 VAC
Board to Board
Cable
Gold
Surface Mount
2.9 A
Phosphor Bronze
90
Square
Header
Male Pin
UL94 V-0
0.05 in
1.27 mm
0.131 in
3.33 mm
Board Guide
Pick and Place
All
0.22 in
5.6 mm
Tin
Shrouded - 4 Wall
30 Áin
0.76 Ám
Black
Liquid Crystal Polymer (LCP)
2
0.05 in
1.27 mm
-55 °C
125 °C
Push-Pull
Solder
275 VAC
Board to Board
Cable
Gold
Surface Mount
2.9 A
Phosphor Bronze
90
Square
Header
Male Pin
UL94 V-0
0.05 in
1.27 mm
0.131 in
3.33 mm
Board Guide
Pick and Place
All
0.22 in
5.6 mm
Tin
Shrouded - 4 Wall
30 Áin
0.76 Ám
Black
Samtec Inc.
Liquid Crystal Polymer (LCP)
2
0.05 in
1.27 mm
-55 °C
125 °C
Push-Pull
Solder
275 VAC
Board to Board
Cable
Gold
Through Hole
2.9 A
Phosphor Bronze
90
Square
Header
Male Pin
UL94 V-0
0.05 in
1.27 mm
0.139 in
3.53 mm
All
0.435 in
11.05 mm
Tin
Shrouded - 4 Wall
15 µin
0.38 µm
Black
2.03 mm
0.08 in
Liquid Crystal Polymer (LCP)
2
0.05 in
1.27 mm
-55 °C
125 °C
Push-Pull
Solder
275 VAC
Board to Board
Cable
Gold
Surface Mount
2.9 A
Phosphor Bronze
90
Square
Header
Male Pin
UL94 V-0
0.05 in
1.27 mm
0.131 in
3.33 mm
Solder Retention
All
0.22 in
5.6 mm
Tin
Shrouded - 4 Wall
30 Áin
0.76 Ám
Black
Samtec Inc.
Liquid Crystal Polymer (LCP)
2
0.05 in
1.27 mm
-55 °C
125 °C
Push-Pull
Solder
275 VAC
Board to Board
Cable
Gold
Surface Mount
2.9 A
Phosphor Bronze
90
Square
Header
Male Pin
UL94 V-0
0.05 in
1.27 mm
0.139 in
3.53 mm
Board Guide
All
0.435 in
11.05 mm
Tin
Shrouded - 4 Wall
30 Áin
0.76 Ám
Black
Liquid Crystal Polymer (LCP)
2
0.05 in
1.27 mm
-55 °C
125 °C
Push-Pull
Solder
275 VAC
Board to Board
Cable
Gold
Through Hole
Right Angle
2.9 A
Phosphor Bronze
90
Square
Elevated
Header
Male Pin
UL94 V-0
0.05 in
1.27 mm
0.139 in
3.53 mm
Solder Retention
All
0.24 in
6.1 mm
Tin
Shrouded - 4 Wall
30 Áin
0.76 Ám
Black
0.078 in
1.98 mm
Liquid Crystal Polymer (LCP)
2
0.05 in
1.27 mm
-55 °C
125 °C
Push-Pull
Solder
275 VAC
Board to Board
Cable
Gold
Through Hole
2.9 A
Phosphor Bronze
90
Square
Header
Male Pin
UL94 V-0
0.05 in
1.27 mm
0.139 in
3.53 mm
All
0.36 in
9.14 mm
Tin
Shrouded - 4 Wall
30 Áin
0.76 Ám
Black
2.03 mm
0.08 in
Samtec Inc.
Liquid Crystal Polymer (LCP)
2
0.05 in
1.27 mm
-55 °C
125 °C
Push-Pull
Solder
275 VAC
Board to Board
Cable
Gold
Through Hole
2.9 A
Phosphor Bronze
90
Square
Header
Male Pin
UL94 V-0
0.05 in
1.27 mm
0.131 in
3.33 mm
Pick and Place
All
0.22 in
5.6 mm
Tin
Shrouded - 4 Wall
30 Áin
0.76 Ám
Black
0.078 in
1.98 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 10.68

Description

General part information

TFM-145 Series

Connector Header Through Hole 90 position 0.050" (1.27mm)

Documents

Technical documentation and resources

No documents available