Specification	SS-106-G-18-N

Connector Type	Receptacle
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 µin
Contact Finish Thickness - Post	10 µin
Contact Material	Beryllium Copper
Contact Shape	Circular
Contact Type	Female Socket
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.1 in
Insulation Material	Polybutylene Terephthalate (PBT), Glass Filled
Mounting Type	Through Hole
Number of Positions	6
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Style	Board
Termination	Solder

SS Series

...

Part	Style	Fastening Type	Number of Positions	Number of Positions Loaded	Number of Rows	Operating Temperature (Max)	Operating Temperature (Min)	Connector Type	Contact Finish Thickness - Mating	Contact Finish - Post	Pitch - Mating	Contact Type	Mounting Type	Insulation Height	Contact Finish - Mating	Insulation Color	Termination	Contact Length - Post	Insulation Material	Contact Shape	Contact Finish Thickness - Post	Contact Material
Samtec Inc. SS-132-G-1C	Board	Push-Pull	32	All	1	125 °C	-55 °C	Receptacle	30 µin	Gold	0.1 in	Female Socket	Through Hole	0.1 in	Gold	Black	Solder	0.26 in	Glass Filled Polybutylene Terephthalate (PBT)	Circular	10 µin	Beryllium Copper
Samtec Inc. SS-132-TT-1A-N	Board	Push-Pull	32	All	1	125 °C	-55 °C	Receptacle		Tin	0.1 in	Female Socket	Through Hole	0.1 in	Tin	Black	Solder	0.36 in	Glass Filled Polybutylene Terephthalate (PBT)	Circular		Beryllium Copper
Samtec Inc. SS-132-G-21C	Board	Push-Pull	32	All	1	125 °C	-55 °C	Receptacle	30 µin	Gold	0.1 in	Female Socket	Through Hole	0.1 in	Gold	Black	Solder	0.26 in	Glass Filled Polybutylene Terephthalate (PBT)	Circular	10 µin	Beryllium Copper
Samtec Inc. SS-132-T-38-N	Board	Push-Pull	32	All	1	125 °C	-55 °C	Receptacle	30 µin	Tin	0.1 in	Female Socket	Through Hole	0.1 in	Gold	Black	Solder	0.18 in	Glass Filled Polybutylene Terephthalate (PBT)	Circular		Beryllium Copper
Samtec Inc. SS-132-G-18	Board	Push-Pull	32	All	1	125 °C	-55 °C	Receptacle	30 µin	Gold	0.1 in	Female Socket	Through Hole	0.1 in	Gold	Black	Solder		Glass Filled Polybutylene Terephthalate (PBT)	Circular	10 µin	Beryllium Copper
Samtec Inc. SS-132-TT-2	Board	Push-Pull	32	All	1	125 °C	-55 °C	Receptacle		Tin	0.1 in	Female Socket	Through Hole	0.1 in	Tin	Black	Solder	0.125 in	Glass Filled Polybutylene Terephthalate (PBT)	Circular		Beryllium Copper
Samtec Inc. SS-132-S-22	Board	Push-Pull	32	All	1	125 °C	-55 °C	Receptacle	10 µin	Tin	0.1 in	Female Socket	Through Hole	0.1 in	Gold	Black	Solder	0.125 in	Glass Filled Polybutylene Terephthalate (PBT)	Circular		Beryllium Copper
Samtec Inc. SS-132-G-29-N	Board	Push-Pull	32	All	1	125 °C	-55 °C	Receptacle	30 µin	Gold	0.1 in	Female Socket	Through Hole	0.1 in	Gold	Black	Solder		Glass Filled Polybutylene Terephthalate (PBT)	Circular	10 µin	Beryllium Copper
Samtec Inc. SS-132-T-18-N	Board	Push-Pull	32	All	1	125 °C	-55 °C	Receptacle	30 µin	Tin	0.1 in	Female Socket	Through Hole	0.1 in	Gold	Black	Solder		Glass Filled Polybutylene Terephthalate (PBT)	Circular		Beryllium Copper
Samtec Inc. SS-132-G-22	Board	Push-Pull	32	All	1	125 °C	-55 °C	Receptacle	30 µin	Gold	0.1 in	Female Socket	Through Hole	0.1 in	Gold	Black	Solder	0.125 in	Glass Filled Polybutylene Terephthalate (PBT)	Circular	10 µin	Beryllium Copper

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