SS-132 Series
Manufacturer: Samtec Inc.
Beta
⌘K
SOCKET STRIPS
| Part | Style | Fastening Type | Number of Positions | Number of Positions Loaded | Number of Rows | Operating Temperature (Max) | Operating Temperature (Min) | Connector Type | Contact Finish Thickness - Mating | Contact Finish - Post | Pitch - Mating | Contact Type | Mounting Type | Insulation Height | Contact Finish - Mating | Insulation Color | Termination | Contact Length - Post | Insulation Material | Contact Shape | Contact Finish Thickness - Post | Contact Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Samtec Inc. | Board | Push-Pull | 32 | All | 1 | 125 °C | -55 °C | Receptacle | 30 µin | Gold | 0.1 in | Female Socket | Through Hole | 0.1 in | Gold | Black | Solder | 0.26 in | Glass Filled Polybutylene Terephthalate (PBT) | Circular | 10 µin | Beryllium Copper |
 Samtec Inc. | Board | Push-Pull | 32 | All | 1 | 125 °C | -55 °C | Receptacle | Tin | 0.1 in | Female Socket | Through Hole | 0.1 in | Tin | Black | Solder | 0.36 in | Glass Filled Polybutylene Terephthalate (PBT) | Circular | Beryllium Copper | ||
Samtec Inc. | Board | Push-Pull | 32 | All | 1 | 125 °C | -55 °C | Receptacle | 30 µin | Gold | 0.1 in | Female Socket | Through Hole | 0.1 in | Gold | Black | Solder | 0.26 in | Glass Filled Polybutylene Terephthalate (PBT) | Circular | 10 µin | Beryllium Copper |
Samtec Inc. | Board | Push-Pull | 32 | All | 1 | 125 °C | -55 °C | Receptacle | 30 µin | Tin | 0.1 in | Female Socket | Through Hole | 0.1 in | Gold | Black | Solder | 0.18 in | Glass Filled Polybutylene Terephthalate (PBT) | Circular | Beryllium Copper | |
Samtec Inc. | Board | Push-Pull | 32 | All | 1 | 125 °C | -55 °C | Receptacle | 30 µin | Gold | 0.1 in | Female Socket | Through Hole | 0.1 in | Gold | Black | Solder | Glass Filled Polybutylene Terephthalate (PBT) | Circular | 10 µin | Beryllium Copper | |
 Samtec Inc. | Board | Push-Pull | 32 | All | 1 | 125 °C | -55 °C | Receptacle | Tin | 0.1 in | Female Socket | Through Hole | 0.1 in | Tin | Black | Solder | 0.125 in | Glass Filled Polybutylene Terephthalate (PBT) | Circular | Beryllium Copper | ||
Samtec Inc. | Board | Push-Pull | 32 | All | 1 | 125 °C | -55 °C | Receptacle | 10 µin | Tin | 0.1 in | Female Socket | Through Hole | 0.1 in | Gold | Black | Solder | 0.125 in | Glass Filled Polybutylene Terephthalate (PBT) | Circular | Beryllium Copper | |
Samtec Inc. | Board | Push-Pull | 32 | All | 1 | 125 °C | -55 °C | Receptacle | 30 µin | Gold | 0.1 in | Female Socket | Through Hole | 0.1 in | Gold | Black | Solder | Glass Filled Polybutylene Terephthalate (PBT) | Circular | 10 µin | Beryllium Copper | |
Samtec Inc. | Board | Push-Pull | 32 | All | 1 | 125 °C | -55 °C | Receptacle | 30 µin | Tin | 0.1 in | Female Socket | Through Hole | 0.1 in | Gold | Black | Solder | Glass Filled Polybutylene Terephthalate (PBT) | Circular | Beryllium Copper | ||
Samtec Inc. | Board | Push-Pull | 32 | All | 1 | 125 °C | -55 °C | Receptacle | 30 µin | Gold | 0.1 in | Female Socket | Through Hole | 0.1 in | Gold | Black | Solder | 0.125 in | Glass Filled Polybutylene Terephthalate (PBT) | Circular | 10 µin | Beryllium Copper |