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RRR040P03HZGTL

RRR040P03HZGTL

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Rohm Semiconductor

MOSFET, P-CH, 30V, 4A, SOT-346T ROHS COMPLIANT: YES

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RRR040P03HZGTL

RRR040P03HZGTL

Active
Rohm Semiconductor

MOSFET, P-CH, 30V, 4A, SOT-346T ROHS COMPLIANT: YES

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Description

General part information

RRR040P03HZG Series

RRR040P03HZG is a MOSFET for switching applications. This is a high-reliability product of automotive grade qualified to AEC-Q101.

Technical Specifications

Parameters and characteristics for this part

SpecificationRRR040P03HZGTL
Current - Continuous Drain (Id) (Ta)4 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On)4 V
Drive Voltage (Min Rds On)10 V
FET TypeP-Channel
Gate Charge (Max)10.5 nC
GradeAutomotive
Input Capacitance (Ciss) (Max)1000 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSC-96
Package NameTSMT3
Power Dissipation (Max)700 mW
QualificationAEC-Q101
Rds On (Max)45 mOhm
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max)2.5 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Technical Data Sheet EN
Taping Information
Basics of Thermal Resistance and Heat Dissipation
Reliability Test Result
Method for Monitoring Switching Waveform
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Temperature derating method for Safe Operating Area (SOA)
MOSFET Gate Resistor Setting for Motor Driving
About Flammability of Materials
RRR040P03HZG ESD Data
Two-Resistor Model for Thermal Simulation
Impedance Characteristics of Bypass Capacitor
How to Use LTspice® Models: Tips for Improving Convergence
PCB Layout Thermal Design Guide
Judgment Criteria of Thermal Evaluation
Notes for Temperature Measurement Using Forward Voltage of PN Junction
About Export Regulations
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Inner Structure
What is a Thermal Model? (Transistor)
Notes for Temperature Measurement Using Thermocouples
How to Use LTspice® Models
Precautions When Measuring the Rear of the Package with a Thermocouple
Measurement Method and Usage of Thermal Resistance RthJC
Anti-Whisker formation - Transistors
How to Create Symbols for PSpice Models
Types and Features of Transistors
Part Explanation
List of Transistor Package Thermal Resistance
Importance of Probe Calibration When Measuring Power: Deskew
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Condition of Soldering / Land Pattern Reference
MOSFET Gate Drive Current Setting for Motor Driving
Moisture Sensitivity Level - Transistors
Notes for Calculating Power Consumption:Static Operation
Certificate of not containing SVHC under REACH Regulation
What Is Thermal Design
Package Dimensions
Compliance of the RoHS directive
Calculation of Power Dissipation in Switching Circuit
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Explanation for Marking