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BU30TD2WNVX-TL

BU30TD2WNVX-TL

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Rohm Semiconductor

200MA 3V, FIXED OUTPUT, HIGH PSRR, HIGH-ACCURACY CMOS LDO REGULATOR

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BU30TD2WNVX-TL

BU30TD2WNVX-TL

Active
Rohm Semiconductor

200MA 3V, FIXED OUTPUT, HIGH PSRR, HIGH-ACCURACY CMOS LDO REGULATOR

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Description

General part information

BU30TD2WNVX Series

The BU**TD2WNVX / BU**TD3WG series integrates a 200mA output high performance FULL CMOS regulator into an ultra-compact SSON004X1010 package (1.0mm×1.0mm×0.6mm) & SSOP5 package(2.9mm×2.8mm×1.15mm). Additional features include a circuit current of only 35µA for low power consumption along with superior noise and load response characteristics, making them ideal for use in power supplies for a wide variety of applications, including logic ICs, RF circuits, and camera modules.

Technical Specifications

Parameters and characteristics for this part

SpecificationBU30TD2WNVX-TL
Control FeaturesEnable
Current - Output200 mA
Current - Quiescent (Iq)60 µA
Mounting TypeSurface Mount
Number of Regulators1
Operating Temperature (Max)85 °C
Operating Temperature (Min)-40 °C
Output ConfigurationPositive
Output TypeFixed
Package / Case4-UDFN Exposed Pad
Package NameSSON004X1010
Protection FeaturesOver Current, Over Temperature
PSRR70 dB
Voltage - Input (Max)6 V
Voltage - Output (Min/Fixed)3 V
Voltage Dropout (Max)0.46 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Datasheet
How to Select Reverse Current Protection Diodes for LDO Regulators
How to Use the Two-Resistor Model
Thermal Resistance Data: SSON004X1010
PCB Layout Thermal Design Guide
Measurement Method for Phase Margin with Frequency Response Analyzer (FRA)
EMC Measures for LDOs
Simple Test Method for Estimating the Stability of Linear Regulators
Impedance Characteristics of Bypass Capacitor
Six Steps for Successful Thermal Design of LDO Regulator ICs
SSON004X1010 Package Information
Connecting LDOs in Parallel
Thermal Resistance
Precautions When Measuring the Rear of the Package with a Thermocouple
UL94 Flame Classifications of Mold Compound
What Is Thermal Design
Power Supply Sequence Circuit with General Purpose Power Supply IC
Problem Situations: Power Supply Does Not Start
Table of resistance for output voltage setting on linear regulator Ics
Calculating Junction Temperature from Inrush Current
Judgment Criteria of Thermal Evaluation
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
Reverse Voltage Protection
BUxxUA3, BUxxTD2 Series PCB Layout
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Thermal Calculation for Linear Regulator
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Power Source ON/OFF Characteristics for Linear Regulator
Factory Information
Basics of Thermal Resistance and Heat Dissipation
Design Guide and Example of Stencil for Exposed Pad
BUxxTD2 Series Dropout Voltage
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Five Steps for Successful Thermal Design of IC
Compliance with the ELV directive
Usage of SPICE Macromodel (for LDO)
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Solder Joint Rate and Thermal Resistance of Exposed Pad
Anti-Whisker formation
Suppression Method of Switching Noise Using Linear Regulator and Low Pass Filter
Basics of Linear Regulators