Specification	BWCT002317114N7J00

Current Rating	800 mA
DC Resistance (DCR) (Max)	60 mOhm
Frequency - Self Resonant	5.5 GHz
Height - Seated (Max)	0.043 in
Inductance	4.7 nH
Inductance Frequency - Test	250 MHz
Material - Core	Ceramic
Mounting Type	Surface Mount
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-40 °C
Package / Case	0805 (2012 Metric)
Package Name	0805
Q	50
Shielding	Unshielded
Size / Dimension Length	0.093 in
Size / Dimension Width	0.068 in
Tolerance	5 %
Type	Drum Core, Wirewound

BWCT Series

RF Inductors - SMD Chilisin RF inductor Wire Wound-Low Profile

Part	Material - Core	Current Rating	Package / Case	DC Resistance (DCR) (Max)	Mounting Type	Size / Dimension Width	Size / Dimension Length	Package Name	Inductance	Tolerance	Shielding	Inductance Frequency - Test	Frequency - Self Resonant	Height - Seated (Max)	Q	Operating Temperature (Max)	Operating Temperature (Min)	Type
Pulse Electronics BWCT002317111N8K00	Ceramic	800 mA	0805 (2012 Metric)	30 mOhm	Surface Mount	0.068 in	0.093 in	0805	1.8 nH	10 %	Unshielded	250 MHz	9.4 GHz	0.043 in	55	125 °C	-40 °C	Drum Core Wirewound
Pulse Electronics BWCT00231711R47J00	Ceramic	0.3 A	0805 (2012 Metric)	1.8 Ohm	Surface Mount	0.068 in	0.093 in	0805	470 nH	5 %	Unshielded	50 MHz	600 MHz	0.043 in	25	125 °C	-40 °C	Drum Core Wirewound
Pulse Electronics BWCT0016090627NG00	Ceramic	0.67 A	0603 (1608 Metric)	270 mOhm	Surface Mount	0.035 in	0.063 in	0603	27 nH	2 %	Unshielded	250 MHz	2.55 GHz	0.024 in	27	125 °C	-40 °C	Drum Core Wirewound
Pulse Electronics BWCT001609063N0J00	Ceramic	1.6 A	0603 (1608 Metric)	39 mOhm	Surface Mount	0.035 in	0.063 in	0603	3 nH	5 %	Unshielded	250 MHz	10.7 GHz	0.024 in	25	125 °C	-40 °C	Drum Core Wirewound
Pulse Electronics BWCT002317111R0G00	Ceramic	0.3 A	0805 (2012 Metric)	3.1 Ohm	Surface Mount	0.068 in	0.093 in	0805	1 µH	2 %	Unshielded	25 MHz	330 MHz	0.043 in	17	125 °C	-40 °C	Drum Core Wirewound
Pulse Electronics BWCT002317114N7J00	Ceramic	800 mA	0805 (2012 Metric)	60 mOhm	Surface Mount	0.068 in	0.093 in	0805	4.7 nH	5 %	Unshielded	250 MHz	5.5 GHz	0.043 in	50	125 °C	-40 °C	Drum Core Wirewound
Pulse Electronics BWCT0023171147NG00	Ceramic	600 mA	0805 (2012 Metric)	390 mOhm	Surface Mount	0.068 in	0.093 in	0805	47 nH	2 %	Unshielded	200 MHz	2 GHz	0.043 in	50	125 °C	-40 °C	Drum Core Wirewound
Pulse Electronics BWCT002317115N1J00	Ceramic	800 mA	0805 (2012 Metric)	60 mOhm	Surface Mount	0.068 in	0.093 in	0805	5.1 nH	5 %	Unshielded	250 MHz	5.5 GHz	0.043 in	50	125 °C	-40 °C	Drum Core Wirewound
Pulse Electronics BWCT001609066N8H00	Ceramic	1.2 A	0603 (1608 Metric)	80 mOhm	Surface Mount	0.035 in	0.063 in	0603	6.8 nH	3 %	Unshielded	250 MHz	4.5 GHz	0.024 in	24	125 °C	-40 °C	Drum Core Wirewound
Pulse Electronics BWCT00231711R10K00	Ceramic	400 mA	0805 (2012 Metric)	640 mOhm	Surface Mount	0.068 in	0.093 in	0805	100 nH	10 %	Unshielded	150 MHz	1.2 GHz	0.043 in	50	125 °C	-40 °C	Drum Core Wirewound

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BWCT002317114N7J00 | Datasheet