8080-1G37

Obsolete

TE Connectivity AMP Connectors

CONN SOCKET TRANSIST TO-3 3POS

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8080-1G37

Obsolete

TE Connectivity AMP Connectors

CONN SOCKET TRANSIST TO-3 3POS

Deep-Dive with AI

DocumentsDatasheet

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

8080 Series

3 (Oval) Pos Transistor, TO-3 Socket Silver Chassis Mount

Documents

Technical documentation and resources

Datasheet

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	8080-1G37	8080 Series

Contact Finish - Mating	Silver	Tin-Lead, Gold, Silver
Contact Finish - Post	Silver	Tin-Lead, Gold, Silver, Tin
Contact Finish Thickness - Mating	500 µin	20 - 500 µin
Contact Finish Thickness - Mating	12.7 µm	0.51 - 12.7 µm
Contact Finish Thickness - Post	12.7 µm	0.51 - 12.7 µm
Contact Finish Thickness - Post	500 µin	20 - 500 µin
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post	Beryllium Copper	Beryllium Copper
Contact Resistance	-	25 mOhm
Features	Closed Frame	Closed Frame
Housing Material	Diallyl Phthalate	Phenolic, Polytetrafluoroethylene (PTFE), Diallyl Phthalate, Fluoropolymer (FP)
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Chassis Mount	Through Hole, Chassis Mount
Number of Positions or Pins (Grid)	3	3 - 4
Operating Temperature [Max]	125 °C	125 °C
Operating Temperature [Min]	-55 °C	-55 °C
Termination	Solder	Solder
Type	Transistor, TO-3	Transistor, TO-3

8080 Series

CONN SOCKET TRANSIST TO-3 3POS

Part	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Operating Temperature [Min]	Operating Temperature [Max]	Type	Features	Housing Material	Contact Material - Mating	Contact Finish - Post	Material Flammability Rating	Contact Material - Post	Termination	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Resistance
TE Connectivity AMP Connectors 8080-1G14	Through Hole	5.08 µm	200 µin	3	-55 °C	125 °C	Transistor, TO-3	Closed Frame	Phenolic	Beryllium Copper	Tin-Lead	UL94 V-0	Beryllium Copper	Solder	Tin-Lead
TE Connectivity AMP Connectors 8080-1G25	Chassis Mount			3	-55 °C	125 °C	Transistor, TO-3	Closed Frame	Polytetrafluoroethylene (PTFE)	Beryllium Copper	Gold		Beryllium Copper	Solder	Gold
TE Connectivity AMP Connectors 8080-1G13	Chassis Mount			3	-55 °C	125 °C	Transistor, TO-3	Closed Frame	Polytetrafluoroethylene (PTFE)	Beryllium Copper	Tin-Lead		Beryllium Copper	Solder	Tin-Lead
TE Connectivity AMP Connectors 8080-1G37	Chassis Mount	12.7 µm	500 µin	3	-55 °C	125 °C	Transistor, TO-3	Closed Frame	Diallyl Phthalate	Beryllium Copper	Silver	UL94 V-0	Beryllium Copper	Solder	Silver	12.7 µm	500 µin
TE Connectivity AMP Connectors 8080-1G31	Chassis Mount			3	-55 °C	125 °C	Transistor, TO-3	Closed Frame	Polytetrafluoroethylene (PTFE)	Beryllium Copper	Tin		Beryllium Copper	Solder
TE Connectivity AMP Connectors 8080-1G24	Chassis Mount	0.51 µm	20 µin	3	-55 °C	125 °C	Transistor, TO-3	Closed Frame	Diallyl Phthalate	Beryllium Copper	Tin-Lead	UL94 V-0	Beryllium Copper	Solder	Tin-Lead	0.51 µm	20 µin	25 mOhm
TE Connectivity AMP Connectors 8080-1G17	Chassis Mount			3	-55 °C	125 °C	Transistor, TO-3	Closed Frame	Polytetrafluoroethylene (PTFE)	Beryllium Copper	Tin		Beryllium Copper	Solder
TE Connectivity AMP Connectors 8080-1G35	Chassis Mount	5.08 µm	200 µin	3	-55 °C	125 °C	Transistor, TO-3	Closed Frame	Diallyl Phthalate	Beryllium Copper	Tin-Lead	UL94 V-0	Beryllium Copper	Solder	Tin-Lead	0.51 µm	20 µin	25 mOhm
TE Connectivity AMP Connectors 8080-1G39	Chassis Mount			3	-55 °C	125 °C	Transistor, TO-3	Closed Frame	Polytetrafluoroethylene (PTFE)	Beryllium Copper	Gold		Beryllium Copper	Solder	Gold
TE Connectivity AMP Connectors 8080-1G45	Chassis Mount			3	-55 °C	125 °C	Transistor, TO-3	Closed Frame	Polytetrafluoroethylene (PTFE)	Beryllium Copper	Tin		Beryllium Copper	Solder