TFZVTR2.0B
ActiveRohm Semiconductor
ZENER DIODES PD 500MW IZ(MA) VZ(V) 2.02-2.2
TFZVTR2.0B
ActiveRohm Semiconductor
ZENER DIODES PD 500MW IZ(MA) VZ(V) 2.02-2.2
Description
General part information
TFZV Series
TFZV3.3B is Zener Diode for voltage regulation. Package is small power mold type and automatic mounting is possible by chip-mounter
Technical Specifications
Parameters and characteristics for this part
| Specification | TFZVTR2.0B |
|---|---|
| Current - Reverse Leakage | 120 µA |
| Impedance (Max) (Zzt) | 140 Ohms |
| Mounting Type | Surface Mount |
| Operating Temperature | 150 °C |
| Package / Case | 2-SMD, Flat Leads |
| Package Name | TUMD2M |
| Power - Max | 0.5 W |
| Tolerance | 5 % |
| Voltage - Zener (Nom) (Vz) | 2 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
TUMD2M TR Taping Spec
TUMD2M Part Marking
Diode Flammability
Anti-Whisker formation - Diodes
PCB Layout for TVS Diodes
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Impedance Characteristics of Bypass Capacitor
Diode Types and Applications
Moisture Sensitivity Level - Diodes
Inner Structure
Power Loss and Thermal Design of Diodes
Compliance of the RoHS directive
What is a Thermal Model? (Diode)
Reliability Test Result
How to Use LTspice® Models: Tips for Improving Convergence
Absolute Maximum Rating and Electrical Characteristics of Diodes
Constitution Materials List
Notes for Temperature Measurement Using Thermocouples
Two-Resistor Model for Thermal Simulation
How to Create Symbols for PSpice Models
What Is Thermal Design
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Low-Side Current Sensing Circuit Design
PCB Layout Thermal Design Guide
Certificate of not containing SVHC under REACH Regulation
Selection Method and Usage of TVS Diodes
Notes for Calculating Power Consumption:Static Operation
How to Select Reverse Current Protection Diodes for LDO Regulators
θ<sub>JA</sub> and Ψ<sub>JT</sub>
What Are TVS Diodes?
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Judgment Criteria of Thermal Evaluation
θ<sub>JC</sub> and Ψ<sub>JT</sub>
About Export Regulations
Package Dimensions
TFZV2.0B Data Sheet
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Basics of Thermal Resistance and Heat Dissipation
ESD Data
How to Use LTspice® Models
Differences between TVS and Zener Diodes
Condition of Soldering / Land Pattern Reference
Method for Monitoring Switching Waveform
Precautions When Measuring the Rear of the Package with a Thermocouple
List of Diode Package Thermal Resistance
Importance of Probe Calibration When Measuring Power: Deskew
Part Explanation
Measurement Method and Usage of Thermal Resistance RthJC
Datasheet
Technical Data Sheet EN