Specification	AGLN010V2-UCG36I

Mounting Type	Surface Mount
Number of Gates	10000
Number of I/O	23
Number of Logic Elements/Cells	260
Operating Temperature (Max)	100 °C
Operating Temperature (Min)	-40 °C
Package / Case	36-WFBGA, CSPBGA
Package Length	3 mm
Package Name	36-UCSP
Package Width	3 mm
Voltage - Supply (Maximum)	1.575 V
Voltage - Supply (Minimum)	1.14 V

AGLN010V2 Series

Ultra Low Density FPGAs

Part	Operating Temperature (Min)	Operating Temperature (Max)	Number of I/O	Mounting Type	Voltage - Supply (Maximum)	Voltage - Supply (Minimum)	Package Name	Package Length	Package Width	Number of Logic Elements/Cells	Package / Case	Number of Gates
Microchip Technology AGLN010V2-UCG36	-20 °C	85 °C	23	Surface Mount	1.575 V	1.14 V	36-UCSP	3 mm	3 mm	260	36-WFBGA CSPBGA	10000
Microchip Technology AGLN010V2-QNG48	-20 °C	85 °C	34	Surface Mount	1.575 V	1.14 V	48-QFN	6 mm	6 mm	260	48-VFQFN Exposed Pad	10000
Microchip Technology AGLN010V2-UCG36I	-40 °C	100 °C	23	Surface Mount	1.575 V	1.14 V	36-UCSP	3 mm	3 mm	260	36-WFBGA CSPBGA	10000

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