Specification	67B3G2504810010R00

Attachment Method	Solder
Height	0.394 in
Length	0.189 in
Material	Beryllium Copper
Plating	Gold
Shelf Life	12 Months
Storage/Refrigeration Temperature (Maximum)	77 °F
Storage/Refrigeration Temperature (Minimum)	50 °F
Type	Fingerstock
Width	0.098 in

67x Series

EMI Gaskets, Sheets, Absorbers & Shielding SP,CON,S,AU,TNR

Part	Height	Length	Width	Type	Operating Temperature (Min)	Operating Temperature (Max)	Attachment Method	Shape	Material	Shelf Life	Storage/Refrigeration Temperature (Minimum)	Storage/Refrigeration Temperature (Maximum)	Plating
Laird Technologies EMI 67SLG100150100PI00	0.591 in	0.394 in	0.394 in	Film Over Foam	-40 °C	70 °C	Solder	Rectangle	Polyurethane Foam Tin-Copper Polyester (SN/CU)
Laird Technologies EMI 67B3G2504810010R00	0.394 in	0.189 in	0.098 in	Fingerstock			Solder		Beryllium Copper	12 Months	50 °F	77 °F	Gold
Laird Technologies EMI 67BCS2003802008R00	0.079 in	0.15 in	0.079 in	Shield Finger					Beryllium Copper				Nickel
Laird Technologies EMI 67SLG050050030PI00	0.197 in	0.118 in	0.197 "	Film Over Foam	-40 °C	70 °C	Solder	Rectangle	Polyurethane Foam Tin-Copper Polyester (SN/CU)
Laird Technologies EMI 67SLH060080070PI00	0.315 in	0.276 in	0.236 in	Film Over Foam	-40 °C	70 °C	Solder	Hourglass	Polyurethane Foam Tin-Copper Polyester (SN/CU)
Laird Technologies EMI 67SLH060080060PI00	0.315 in	0.236 in	0.236 in	Film Over Foam	-40 °C	70 °C			CU) Tin-Copper Polyester (SN
Laird Technologies EMI 67BCG2504303510R00	0.138 in	0.169 in	0.098 in	Fingerstock			Solder		Beryllium Copper	12 Months	50 °F	77 °F	Gold
Laird Technologies EMI 67BCS2004002008R00	0.079 in	0.157 in	0.079 in	Shield Finger					Beryllium Copper				Nickel

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