Specification	XCKU3P-L1FFVD900I

Mounting Type	Surface Mount
Number of I/O	304
Number of LABs/CLBs	20340
Number of Logic Elements/Cells	355950
Operating Temperature (Max)	100 °C
Operating Temperature (Min)	-40 °C
Package / Case	FCBGA, 900-BBGA
Package Length	31 mm
Package Name	900-FCBGA
Package Width	31 mm
Total RAM Bits	31641600 bits
Voltage - Supply (Maximum)	0.876 V
Voltage - Supply (Minimum)	0.698 V

XCKU3 Series

Part	Number of Logic Elements/Cells	Mounting Type	Total RAM Bits	Operating Temperature (Max)	Operating Temperature (Min)	Number of LABs/CLBs	Package / Case	Package Width	Package Name	Package Length	Voltage - Supply (Maximum)	Voltage - Supply (Minimum)	Number of I/O
AMD / Xilinx XCKU3P-1SFVB784I	355950	Surface Mount	31641600 bits	100 °C	-40 °C	20340	784-BFBGA FCBGA	23 mm	784-FCBGA	23 mm	0.876 V	0.825 V	256
AMD / Xilinx XCKU3P-2FFVA676E	355950	Surface Mount	31641600 bits	100 °C	0 °C	20340	676-BBGA FCBGA	27 mm	676-FCBGA	27 mm	0.876 V	0.825 V	256
AMD / Xilinx XCKU3P-L1SFVB784I	355950	Surface Mount	31641600 bits	100 °C	-40 °C	20340	784-BFBGA FCBGA	23 mm	784-FCBGA	23 mm	0.876 V	0.698 V	256
AMD / Xilinx XCKU3P-1FFVD900E	355950	Surface Mount	31641600 bits	100 °C	0 °C	20340	900-BBGA FCBGA	31 mm	900-FCBGA	31 mm	0.876 V	0.825 V	304
AMD / Xilinx XCKU3P-1SFVB784E	355950	Surface Mount	31641600 bits	100 °C	0 °C	20340	784-BFBGA FCBGA	23 mm	784-FCBGA	23 mm	0.876 V	0.825 V	304
AMD / Xilinx XCKU3P-L2SFVB784E	355950	Surface Mount	31641600 bits	100 °C	0 °C	20340	784-BFBGA FCBGA	23 mm	784-FCBGA	23 mm	0.876 V	0.698 V	256
AMD / Xilinx XCKU3P-2FFVD900I	355950	Surface Mount	31641600 bits	100 °C	-40 °C	20340	900-BBGA FCBGA	31 mm	900-FCBGA	31 mm	0.876 V	0.825 V	304
AMD / Xilinx XCKU3P-2FFVB676E	355950	Surface Mount	31641600 bits	100 °C	0 °C	20340	676-BBGA FCBGA	27 mm	676-FCBGA	27 mm	0.876 V	0.825 V	280
AMD / Xilinx XCKU3P-L1FFVD900I	355950	Surface Mount	31641600 bits	100 °C	-40 °C	20340	900-BBGA FCBGA	31 mm	900-FCBGA	31 mm	0.876 V	0.698 V	304

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