Specification	BM10NB(0.8)-24DS-0.4V(51)

Connector Type	Center Strip Contacts, Receptacle
Contact Finish	Gold
Contact Finish Thickness	2 µin
Features	Solder Retention
Height Above Board	0.031 in
Mated Stacking Height	0.8 mm
Mounting Type	Surface Mount
Number of Positions	24 pos
Number of Rows	2
Pitch	0.016 in

BM10 Series

Board to Board & Mezzanine Connectors 0.4MM FPC TO BOARD 10P RECP 0.6 HGHT

Part	Features	Contact Finish Thickness	Height Above Board	Contact Finish	Connector Type	Number of Rows	Number of Positions	Pitch	Mounting Type	Mated Stacking Height
Hirose Electric Co Ltd BM10NB(0.8)-44DS-0.4V(51)	Solder Retention	2 µin	0.031 in	Gold	Center Strip Contacts Receptacle	2	44	0.016 in	Surface Mount	0.8 mm
Hirose Electric Co Ltd BM10NB(0.6)-50DS-0.4V(51)	Solder Retention	2 µin	0.024 in	Gold	Center Strip Contacts Receptacle	2	50	0.016 in	Surface Mount	0.6 mm
Hirose Electric Co Ltd BM10NB(0.8)-24DS-0.4V(51)	Solder Retention	2 µin	0.031 in	Gold	Center Strip Contacts Receptacle	2	24 pos	0.016 in	Surface Mount	0.8 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Create a free account to access distributor pricing data.

3D models and CAD resources for this part

Technical documentation and resources