116-87-210-41-007101

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Preci-Dip

CONN IC DIP SOCKET 10POS GOLD

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116-87-210-41-007101

Active

Preci-Dip

CONN IC DIP SOCKET 10POS GOLD

Deep-Dive with AI

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	900	$ 1.15

Description

General part information

116-87 Series

10 (2 x 5) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources

No documents available

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	116-87-210-41-007101	116-87 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Tin	Tin
Contact Finish Thickness - Mating	Flash	Flash
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post [custom]	Brass	Brass
Contact Resistance	10 mOhm	10 mOhm
Current Rating (Amps)	1 A	1 A
Features	Open Frame, Elevated	Open Frame, Elevated
Housing Material	Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)	Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole
Number of Positions or Pins (Grid)	-	32
Number of Positions or Pins (Grid)	-	2 - 48
Number of Positions or Pins (Grid)	-	4
Number of Positions or Pins (Grid)	-	2
Number of Positions or Pins (Grid)	-	6 - 50
Number of Positions or Pins (Grid)	-	3 - 20
Number of Positions or Pins (Grid)	-	25
Number of Positions or Pins (Grid) [custom]	2 x 5	2 x 16, 2 x 5
Number of Positions or Pins (Grid) [custom]	10	10
Operating Temperature [Max]	125 °C	125 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length	3.18 mm	3.18 mm
Termination Post Length	0.125 in	0.125 in
Type	DIP	DIP
Type	5.08 mm	5.08 - 15.24 mm
Type	0.2 in	0.2 - 0.6 in

116-87 Series

CONN IC DIP SOCKET 32POS GOLD

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Part	Material Flammability Rating	Contact Material - Post [custom]	Contact Finish - Post	Termination	Mounting Type	Termination Post Length	Termination Post Length	Housing Material	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Material - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish Thickness - Mating	Pitch - Post	Pitch - Post	Contact Resistance	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Features	Type	Type	Type	Current Rating (Amps)	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]
Preci-Dip 116-87-432-41-003101	UL94 V-0	Brass	Tin	Solder	Through Hole	3.18 mm	0.125 in	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	2 x 16	32	Beryllium Copper	-55 °C	125 °C	Flash	2.54 mm	0.1 in	10 mOhm	0.1 in	2.54 mm	Gold	Elevated, Open Frame	0.4 in	10.16 mm	DIP	1 A
Preci-Dip 116-87-628-41-009101	UL94 V-0	Brass	Tin	Solder	Through Hole	3.18 mm	0.125 in	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester			Beryllium Copper	-55 °C	125 °C	Flash	2.54 mm	0.1 in	10 mOhm	0.1 in	2.54 mm	Gold	Elevated, Open Frame	0.6 in	15.24 mm	DIP	1 A	28
Preci-Dip 116-87-308-41-004101	UL94 V-0	Brass	Tin	Solder	Through Hole	3.18 mm	0.125 in	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester			Beryllium Copper	-55 °C	125 °C	Flash	2.54 mm	0.1 in	10 mOhm	0.1 in	2.54 mm	Gold	Elevated, Open Frame	0.3 "	7.62 mm	DIP	1 A	8
Preci-Dip 116-87-424-41-001101	UL94 V-0	Brass	Tin	Solder	Through Hole	3.18 mm	0.125 in	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester			Beryllium Copper	-55 °C	125 °C	Flash	2.54 mm	0.1 in	10 mOhm	0.1 in	2.54 mm	Gold	Elevated, Open Frame	0.4 in	10.16 mm	DIP	1 A	24
Preci-Dip 116-87-422-41-009101	UL94 V-0	Brass	Tin	Solder	Through Hole	3.18 mm	0.125 in	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester			Beryllium Copper	-55 °C	125 °C	Flash	2.54 mm	0.1 in	10 mOhm	0.1 in	2.54 mm	Gold	Elevated, Open Frame	0.4 in	10.16 mm	DIP	1 A	22
Preci-Dip 116-87-320-41-011101	UL94 V-0	Brass	Tin	Solder	Through Hole	3.18 mm	0.125 in	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester			Beryllium Copper	-55 °C	125 °C	Flash	2.54 mm	0.1 in	10 mOhm	0.1 in	2.54 mm	Gold	Elevated, Open Frame	0.3 "	7.62 mm	DIP	1 A	20
Preci-Dip 116-87-310-41-003101	UL94 V-0	Brass	Tin	Solder	Through Hole	3.18 mm	0.125 in	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	2 x 5		Beryllium Copper	-55 °C	125 °C	Flash	2.54 mm	0.1 in	10 mOhm	0.1 in	2.54 mm	Gold	Elevated, Open Frame	0.3 "	7.62 mm	DIP	1 A		10
Preci-Dip 116-87-642-41-009101	UL94 V-0	Brass	Tin	Solder	Through Hole	3.18 mm	0.125 in	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester			Beryllium Copper	-55 °C	125 °C	Flash	2.54 mm	0.1 in	10 mOhm	0.1 in	2.54 mm	Gold	Elevated, Open Frame	0.6 in	15.24 mm	DIP	1 A	42
Preci-Dip 116-87-310-41-008101	UL94 V-0	Brass	Tin	Solder	Through Hole	3.18 mm	0.125 in	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	2 x 5		Beryllium Copper	-55 °C	125 °C	Flash	2.54 mm	0.1 in	10 mOhm	0.1 in	2.54 mm	Gold	Elevated, Open Frame	0.3 "	7.62 mm	DIP	1 A		10
Preci-Dip 116-87-632-41-012101	UL94 V-0	Brass	Tin	Solder	Through Hole	3.18 mm	0.125 in	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	2 x 16	32	Beryllium Copper	-55 °C	125 °C	Flash	2.54 mm	0.1 in	10 mOhm	0.1 in	2.54 mm	Gold	Elevated, Open Frame	0.6 in	15.24 mm	DIP	1 A