Specification	68-PGM11032-11

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	10 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Housing Material	Nylon 4/6, Glass Filled, PA46, Polyamide
Mounting Type	Through Hole
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Termination	Solder
Type	PGA

PGM Series

Part	Type	Contact Finish Thickness - Mating	Pitch - Mating	Contact Material - Post	Mounting Type	Contact Finish - Mating	Contact Finish - Post	Operating Temperature (Min)	Operating Temperature (Max)	Termination	Contact Finish Thickness - Post	Contact Material - Mating	Housing Material	Pitch - Post	Material Flammability Rating	Termination Post Length	Current Rating
Aries Electronics 160-PGM14029-40	PGA	10 µin	0.1 in	Brass	Through Hole	Gold	Tin	-55 °C	105 °C	Solder	200 µin	Beryllium Copper	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in
Aries Electronics 81-PGM09001-10	PGA	10 µin	0.1 in	Brass	Through Hole	Gold	Tin	-55 °C	105 °C	Solder	200 µin	Beryllium Copper	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	UL94 V-0	0.165 in	3 A
Aries Electronics 68-PGM11032-11	PGA	10 µin	0.1 in	Brass	Through Hole	Gold	Gold	-55 °C	125 °C	Solder	10 µin	Beryllium Copper	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in
Aries Electronics 100-PGM13069-11	PGA	10 µin	0.1 in	Brass	Through Hole	Gold	Gold	-55 °C	125 °C	Solder	10 µin	Beryllium Copper	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in

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