Specification	PIC32CK1025GC01064-I/3ZB

A/D Channels	13 count
A/D Resolution (bits)	12 bit
Connectivity	QSPI, SPI, LINbus, CANbus, SDHC, MMC, SDIO, IrDA, UART, USB, SD, USART, Ethernet, I2C
Converter Architecture	SAR
Core Processor	ARM® Cortex®-M33
Core Size (Bit Width)	32 Bit
Mounting Type	Surface Mount
Number of I/O	50
Operating Temperature (Max)	85 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	Internal, External
Package / Case	64-TQFP Exposed Pad
Package Length	10 mm
Package Name	64-TQFP
Package Width	10 mm
Peripherals	TRNG, DMA, Temp Sensor, LVD, PWM, POR, LVR, I2S, IR, Reset, Brown-out Detect, WDT
Program Memory Depth	1 M
Program Memory Size	1 MB
Program Memory Type	FLASH
Program Memory Width	8 bit
RAM Size Depth	256 K
RAM Size Width	8 bit
Speed	120 MHz
Voltage - Supply (Vcc/Vdd) Maximum	3.63 V
Voltage - Supply (Vcc/Vdd) Minimum	1.71 V

PIC32CK1025GC01064 Series

Arm® Cortex®-M33 Based MCU with 1 MB Flash/256 KB SRAM

Part	Package Width	Package Name	Package Length	Speed	RAM Size Depth	RAM Size Width	Peripherals	Number of I/O	Core Size (Bit Width)	Mounting Type	Core Processor	Oscillator Type	Voltage - Supply (Vcc/Vdd) Minimum	Voltage - Supply (Vcc/Vdd) Maximum	Package / Case	Connectivity	A/D Resolution (bits)	Converter Architecture	A/D Channels	Program Memory Type	Operating Temperature (Max)	Operating Temperature (Min)	Program Memory Size	Program Memory Width	Program Memory Depth
Microchip Technology PIC32CK1025GC01064-I/3ZB	10 mm	64-TQFP	10 mm	120 MHz	256 K	8 bit	Brown-out Detect DMA I2S IR LVD LVR POR PWM Reset Temp Sensor TRNG WDT	50	32 Bit	Surface Mount	ARM® Cortex®-M33	External Internal	1.71 V	3.63 V	64-TQFP Exposed Pad	CANbus Ethernet I2C IrDA LINbus MMC QSPI SD SDHC SDIO SPI UART USART USB	12 bit	SAR	13 count	FLASH	85 °C	-40 °C	1 MB	8 bit	1 M

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