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LPC55S16JBD100K

LPC55S16JBD100K

Active
NXP USA Inc.

HIGH EFFICIENCY ARM CORTEX-M33-BASED MICROCONTROLLER/ TRAY ROHS COMPLIANT: YES

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LPC55S16JBD100K

LPC55S16JBD100K

Active
NXP USA Inc.

HIGH EFFICIENCY ARM CORTEX-M33-BASED MICROCONTROLLER/ TRAY ROHS COMPLIANT: YES

Find alt

Description

General part information

LPC55S16 Series

256KB flash, 96KB total SRAM, CASPER crypto/FFT engine, RNG, CANFD, 64 GPIO, USB FS + HS

Secure boot, PRINCE model, PUF controller, HASH-AES, TrustZone

Operating temperature range from -40°C to +105°C, HLQFP100 package

Technical Specifications

Parameters and characteristics for this part

SpecificationLPC55S16JBD100K
A/D Channels10 count
A/D Resolution (bits)16 bit
ConnectivitySPI, USART, CAN FD, USB, I2C, UART, Flexcomm
Converter ArchitectureSAR
Core ConfigurationSingle-Core
Core ProcessorARM® Cortex®-M33
Core Size (Bit Width)32 Bit
Mounting TypeSurface Mount
Number of I/O64
Operating Temperature (Max)105 °C
Operating Temperature (Min)-40 °C
Oscillator TypeInternal, External
Package / Case100-LQFP Exposed Pad
Package Length14 mm
Package Name100-HLQFP
Package Width14 mm
PeripheralsPOR, PWM, DMA, I2S, Reset, WDT, RNG, Brown-out Detect
Program Memory Depth256 K
Program Memory Size256 KB
Program Memory TypeFLASH
Program Memory Width8 bit
RAM Size Depth96 K
RAM Size Width8 bit
Speed150 MHz
Voltage - Supply (Vcc/Vdd) Maximum3.6 V
Voltage - Supply (Vcc/Vdd) Minimum1.8 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources