
LPC55S16JBD100K
ActiveNXP USA Inc.
HIGH EFFICIENCY ARM CORTEX-M33-BASED MICROCONTROLLER/ TRAY ROHS COMPLIANT: YES

LPC55S16JBD100K
ActiveNXP USA Inc.
HIGH EFFICIENCY ARM CORTEX-M33-BASED MICROCONTROLLER/ TRAY ROHS COMPLIANT: YES
Description
General part information
LPC55S16 Series
256KB flash, 96KB total SRAM, CASPER crypto/FFT engine, RNG, CANFD, 64 GPIO, USB FS + HS
Secure boot, PRINCE model, PUF controller, HASH-AES, TrustZone
Operating temperature range from -40°C to +105°C, HLQFP100 package
Technical Specifications
Parameters and characteristics for this part
| Specification | LPC55S16JBD100K |
|---|---|
| A/D Channels | 10 count |
| A/D Resolution (bits) | 16 bit |
| Connectivity | SPI, USART, CAN FD, USB, I2C, UART, Flexcomm |
| Converter Architecture | SAR |
| Core Configuration | Single-Core |
| Core Processor | ARM® Cortex®-M33 |
| Core Size (Bit Width) | 32 Bit |
| Mounting Type | Surface Mount |
| Number of I/O | 64 |
| Operating Temperature (Max) | 105 °C |
| Operating Temperature (Min) | -40 °C |
| Oscillator Type | Internal, External |
| Package / Case | 100-LQFP Exposed Pad |
| Package Length | 14 mm |
| Package Name | 100-HLQFP |
| Package Width | 14 mm |
| Peripherals | POR, PWM, DMA, I2S, Reset, WDT, RNG, Brown-out Detect |
| Program Memory Depth | 256 K |
| Program Memory Size | 256 KB |
| Program Memory Type | FLASH |
| Program Memory Width | 8 bit |
| RAM Size Depth | 96 K |
| RAM Size Width | 8 bit |
| Speed | 150 MHz |
| Voltage - Supply (Vcc/Vdd) Maximum | 3.6 V |
| Voltage - Supply (Vcc/Vdd) Minimum | 1.8 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources