Infineon’s AIROC™ CYBT-353027-02 is a fully certified Bluetooth® Smart Ready wireless embedded module based on a proven hardware design and Infineon’s AIROC™ CYW20706 silicon device. This module is ideal for applications requiring an extended temperature operation of up to +105oC. The CYBT-353027-02 includes a royalty-free BLE stack compatible with Bluetooth® 5.0 in a 9.0 × 9.0 × 1.75 mm SMT package form-factor, with a PCB Trace antenna. This device is certified to FCC, ISED, MIC, and CE regulations. The CYBT-353027-02 supports peripheral functions (ADC and PWM), UART, I2C, and SPI communication, and a Bluetooth® audio interface. This device provides all necessary components required to operate Bluetooth® LE and/or BR/EDR communication standards with a Maximum TX output power of +12 dBm for Bluetooth® Classic, +9 dBm for Bluetooth® Low Energy modes. This highly integrated module is globally certified to support fast time-to-market, helping cutdown the additional time needed for design, development and certification. Infineon’s AIROC™ CYBT-353027-02 module complies with Bluetooth® core specification version 5.0 and has gone through SIG qualification with QDID: 109292 and Declaration ID:D039123 Infineon’s AIROC™ module CYBT-353027-02 is designed for Bluetooth® wideband speech support.