
RBR10NS60AFHTL
ActiveRohm Semiconductor
LOW VF, 60V, 10A, TO-263S (D2PAK), SCHOTTKY BARRIER DIODE FOR AUTOMOTIVE

RBR10NS60AFHTL
ActiveRohm Semiconductor
LOW VF, 60V, 10A, TO-263S (D2PAK), SCHOTTKY BARRIER DIODE FOR AUTOMOTIVE
Description
General part information
RBR10 Series
RBR10NS30AFH is the high reliability Automotive Schottky Barrier Diode, suitable for Switching power supply.
Technical Specifications
Parameters and characteristics for this part
| Specification | RBR10NS60AFHTL |
|---|---|
| Current - Average Rectified (Io) (per Diode) | 10 A |
| Current - Reverse Leakage | 200 µA |
| Diode Configuration | Common Cathode |
| Diode Pair Count | 1 pair |
| Grade | Automotive |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction (Max) | 150 °C |
| Package / Case | D2PAK (2 Leads + Tab), TO-263-3, TO-263AB |
| Package Name | LPDS |
| Qualification | AEC-Q101 |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 60 V |
| Voltage - Forward (Vf) (Max) | 650 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Technical Data Sheet EN
How to Select Rectifier Diodes
Measurement Method and Usage of Thermal Resistance RthJC
What is a Thermal Model? (Diode)
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Part Explanation
Notes for Calculating Power Consumption:Static Operation
How to Use LTspice® Models
Diode Types and Applications
Report of SVHC under REACH Regulation
About Export Regulations
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Compliance of the RoHS directive
Notes for Temperature Measurement Using Thermocouples
How to Create Symbols for PSpice Models
Two-Resistor Model for Thermal Simulation
Method for Monitoring Switching Waveform
ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment
Inner Structure
Diode Selection Method for Asynchronous Converter
PCB Layout Thermal Design Guide
What Is Thermal Design
Anti-Whisker formation - Diodes
Reliability Test Result
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Power Loss and Thermal Design of Diodes
How to Select Reverse Current Protection Diodes for LDO Regulators
How to Use LTspice® Models: Tips for Improving Convergence
ESD Data
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Importance of Probe Calibration When Measuring Power: Deskew
Basics of Thermal Resistance and Heat Dissipation
Judgment Criteria of Thermal Evaluation
Constitution Materials List
Precautions When Measuring the Rear of the Package with a Thermocouple
List of Diode Package Thermal Resistance
Impedance Characteristics of Bypass Capacitor
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Absolute Maximum Rating and Electrical Characteristics of Diodes