Specification	18-351000-11-RC

Board Material	FR4 Epoxy Glass
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Post	10 µin
Contact Material - Post	Brass
Convert From (Adapter End)	SSOP
Convert To (Adapter End) Size	0.3 in
Convert To (Adapter End) Type	DIP, Row Spacing
Mounting Type	Through Hole
Number of Pins	18 pins
Pitch - Mating	0.026 in
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.125 in

18-3510 Series

Part	Contact Finish Thickness - Post	Termination Post Length	Contact Material - Post	Convert To (Adapter End) Size	Convert To (Adapter End) Type	Number of Pins	Mounting Type	Convert From (Adapter End)	Contact Finish - Mating	Contact Finish - Post	Board Material	Pitch - Post	Termination	Pitch - Mating
Aries Electronics 18-351000-11-RC	10 µin	0.125 in	Brass	0.3 in	DIP Row Spacing	18 pins	Through Hole	SSOP	Gold	Gold	FR4 Epoxy Glass	0.1 in	Solder	0.026 in
Aries Electronics 18-351000-10	200 µin	0.125 in	Brass	0.3 in	DIP Row Spacing	18 pins	Through Hole	SSOP		Tin-Lead	FR4 Epoxy Glass	0.1 in	Solder	0.026 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Create a free account to access distributor pricing data.

3D models and CAD resources for this part

Technical documentation and resources