Specification	LPC5514JBD64E

A/D Channels	10 count
A/D Resolution (bits)	16 bit
Connectivity	SPI, USART, CAN FD, USB, I2C, UART, Flexcomm
Converter Architecture	SAR
Core Configuration	Single-Core
Core Processor	ARM® Cortex®-M33
Core Size (Bit Width)	32 Bit
Mounting Type	Surface Mount
Number of I/O	36
Operating Temperature (Max)	105 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	Internal, External
Package / Case	64-TQFP Exposed Pad
Package Length	10 mm
Package Name	64-HTQFP
Package Width	10 mm
Peripherals	POR, PWM, DMA, I2S, Reset, WDT, RNG, Brown-out Detect
Program Memory Depth (128KB)	128 K
Program Memory Size	128KB
Program Memory Type	FLASH
Program Memory Width (128KB)	8
RAM Size Depth	80 K
RAM Size Width	8 bit
Speed	150 MHz
Voltage - Supply (Vcc/Vdd) Maximum	3.6 V
Voltage - Supply (Vcc/Vdd) Minimum	1.8 V

LPC5514 Series

Part	Number of I/O	Speed	Operating Temperature (Max)	Operating Temperature (Min)	A/D Channels	Converter Architecture	A/D Resolution (bits)	Program Memory Type	Core Size (Bit Width)	Core Processor	Package Width	Package Name	Package Length	Oscillator Type	Mounting Type	Voltage - Supply (Vcc/Vdd) Maximum	Voltage - Supply (Vcc/Vdd) Minimum	Program Memory Depth (128KB)	Program Memory Size	Program Memory Width (128KB)	Package / Case	RAM Size Depth	RAM Size Width	Connectivity	Peripherals	Core Configuration
NXP USA Inc. LPC5514JBD64K	36	150 MHz	105 °C	-40 °C	10 count	SAR	16 bit	FLASH	32 Bit	ARM® Cortex®-M33	10 mm	64-HTQFP	10 mm	External Internal	Surface Mount	3.6 V	1.8 V	128 K	128KB	8	64-TQFP Exposed Pad	80 K	8 bit	CAN FD Flexcomm I2C SPI UART USART USB	Brown-out Detect DMA I2S POR PWM Reset RNG WDT	Single-Core
NXP USA Inc. LPC5514JBD100K	64	150 MHz	105 °C	-40 °C	10 count	SAR	16 bit	FLASH	32 Bit	ARM® Cortex®-M33	14 mm	100-HLQFP	14 mm	External Internal	Surface Mount	3.6 V	1.8 V	128 K	128KB	8	100-LQFP Exposed Pad	80 K	8 bit	CAN FD Flexcomm I2C SPI UART USART USB	Brown-out Detect DMA I2S POR PWM Reset RNG WDT	Single-Core
NXP USA Inc. LPC5514JBD100E	64	150 MHz	105 °C	-40 °C	10 count	SAR	16 bit	FLASH	32 Bit	ARM® Cortex®-M33	14 mm	100-HLQFP	14 mm	External Internal	Surface Mount	3.6 V	1.8 V	128 K	128KB	8	100-LQFP Exposed Pad	80 K	8 bit	CAN FD Flexcomm I2C SPI UART USART USB	Brown-out Detect DMA I2S POR PWM Reset RNG WDT	Single-Core
NXP USA Inc. LPC5514JBD64E	36	150 MHz	105 °C	-40 °C	10 count	SAR	16 bit	FLASH	32 Bit	ARM® Cortex®-M33	10 mm	64-HTQFP	10 mm	External Internal	Surface Mount	3.6 V	1.8 V	128 K	128KB	8	64-TQFP Exposed Pad	80 K	8 bit	CAN FD Flexcomm I2C SPI UART USART USB	Brown-out Detect DMA I2S POR PWM Reset RNG WDT	Single-Core
NXP USA Inc. LPC5514JBD100Y	64	150 MHz	105 °C	-40 °C	10 count	SAR	16 bit	FLASH	32 Bit	ARM® Cortex®-M33	14 mm	100-HLQFP	14 mm	External Internal	Surface Mount	3.6 V	1.8 V	128 K	128KB	8	100-LQFP Exposed Pad	80 K	8 bit	CAN FD Flexcomm I2C SPI UART USART USB	Brown-out Detect DMA I2S POR PWM Reset RNG WDT	Single-Core
NXP USA Inc. LPC5514JBD64Y	36	150 MHz	105 °C	-40 °C	10 count	SAR	16 bit	FLASH	32 Bit	ARM® Cortex®-M33	10 mm	64-HTQFP	10 mm	External Internal	Surface Mount	3.6 V	1.8 V	128 K	128KB	8	64-TQFP Exposed Pad	80 K	8 bit	CAN FD Flexcomm I2C SPI UART USART USB	Brown-out Detect DMA I2S POR PWM Reset RNG WDT	Single-Core
NXP USA Inc. LPC5514JBD100E	64	150 MHz	105 °C	-40 °C	10 count	SAR	16 bit	FLASH	32 Bit	ARM® Cortex®-M33	14 mm	100-HLQFP	14 mm	Internal	Surface Mount	3.6 V	1.8 V	128 K	128KB	8	100-LQFP	80 K	8 bit	Flexcomm I2C SPI UART USART USB	Brown-out Detect DMA I2S POR PWM Reset RNG WDT

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Create a free account to access distributor pricing data.

CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

LPC5514JBD64E | Datasheet

Datasheet

Technical Data Sheet EN

Product Change Notice EN