The800V CoolMOS™ P7superjunction MOSFET series is a perfect fit for low-powerSMPS applicationsby fully addressing market needs in performance, ease-of-use and price/performance ratio. It mainly focuses on flyback applications includingadapter and charger,audio SMPS, AUX and industrial power. It offers up to 0.6% efficiency gain and 2°C to 8°C lower MOSFET temperature compared to its predecessor as well as to competitor parts tested in typical flyback applications. It also enables higher power density designs through lower switching losses and better DPAK RDS(on)products. Overall, it helps customers save BOM cost and reduce assembly effort. The ThinPAK 5x6 package is characterized by a very small footprint of 5x6 mm² and a very low profile with a height of 1 mm. Together with its benchmark low parasitics, these features lead to significantly smaller form factors and help to boost power density. This combination makesCoolMOS™ P7 in ThinPAK5x6 a perfect fit for its target applications.