RGW50TK65GVC11
ActiveRohm Semiconductor
HIGH-SPEED FAST SWITCHING TYPE, 650V 18A, TO-3PFM, FIELD STOP TRENCH IGBT
RGW50TK65GVC11
ActiveRohm Semiconductor
HIGH-SPEED FAST SWITCHING TYPE, 650V 18A, TO-3PFM, FIELD STOP TRENCH IGBT
Description
General part information
RGW50TK65 Series
RGW50TK65 is a high speed switching IGBT, suitable for PFC, Solar Inverter, UPS, Welding, IH applications.
Technical Specifications
Parameters and characteristics for this part
| Specification | RGW50TK65GVC11 |
|---|---|
| Current - Collector (Ic) (Max) | 30 A |
| Current - Collector Pulsed (Icm) | 100 A |
| Gate Charge | 73 nC |
| IGBT Type | Trench Field Stop |
| Input Type | Standard |
| Mounting Type | Through Hole |
| Operating Temperature (Max) | 175 °C |
| Operating Temperature (Min) | -40 °C |
| Package / Case | TO-3PFM, SC-93-3 |
| Package Name | TO-3PFM |
| Power - Max | 67 W |
| Switching Energy (Off) | 430 µJ |
| Switching Energy (On) | 390 µJ |
| Td (off) @ 25°C | 102 ns |
| Td (on) @ 25°C | 35 ns |
| Test Condition Current | 25 A |
| Test Condition Resistance | 10 Ohm |
| Test Condition Voltage | 400 V |
| Test Condition Voltage (Secondary) | 15 V |
| Vce(on) (Max) | 1.9 V |
| Voltage - Collector Emitter Breakdown (Max) | 650 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Impedance Characteristics of Bypass Capacitor
Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules
How to Use LTspice® Models: Tips for Improving Convergence
Estimation of switching losses in IGBTs operating with resistive load
Precautions When Measuring the Rear of the Package with a Thermocouple
Basics of Thermal Resistance and Heat Dissipation
Package Dimensions
Calculation of Power Dissipation in Switching Circuit
Notes for Temperature Measurement Using Thermocouples
How to Use LTspice® Models
θ<sub>JA</sub> and Ψ<sub>JT</sub>
The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level
About Flammability of Materials
Judgment Criteria of Thermal Evaluation
Precautions for Thermal Resistance of Insulation Sheet
About Export Administration Regulations (EAR)
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Types and Features of Transistors
Generation Mechanism of Voltage Surge on Commutation Side (Basic)
PCB Layout Thermal Design Guide
Notes for Calculating Power Consumption:Static Operation
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Two-Resistor Model for Thermal Simulation
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Anti-Whisker formation
Part Explanation
What is a Thermal Model? (IGBT)
Moisture Sensitivity Level
Compliance of the ELV directive
What Is Thermal Design
Method for Monitoring Switching Waveform
Power Eco Family: Overview of ROHM's Power Semiconductor Lineup
Measurement Method and Usage of Thermal Resistance RthJC
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Importance of Probe Calibration When Measuring Power: Deskew
4 Steps for Successful Thermal Designing of Power Devices