UJA1061TW/5V0/C/T/

Obsolete

HIGH PERFORMANCE SYSTEM BASIS CHIP IC AUTOMOTIVE AEC-Q100

Obsolete

HIGH PERFORMANCE SYSTEM BASIS CHIP IC AUTOMOTIVE AEC-Q100

Description

General part information

Networking Interface 32-HTSSOP

Parameters and characteristics for this part

Part	Mounting Type	Grade	Interface	Package Name	Voltage - Supply	Package Length	Package Features	Package Width	Voltage - Supply (Minimum)	Voltage - Supply (Maximum)	Applications
NXP USA Inc. UJA1069TW24/5V0/C:	Surface Mount	Automotive	LIN (Local Interconnect Network)	24-HTSSOP 24-TSSOP	5 VDC	0.173 in	Exposed Pad	4.4 mm
NXP USA Inc. UJA1061TW/3V3/C/T,	Surface Mount	Automotive	CAN LIN	32-HTSSOP 32-TSSOP		0.24 in	Exposed Pad	6.1 mm	5.5 V	27 VDC	Networking
NXP USA Inc. UJA1061TW/5V0/C/T/	Surface Mount	Automotive	CAN LIN	32-HTSSOP 32-TSSOP		0.24 in	Exposed Pad	6.1 mm	5.5 V	27 VDC	Networking
NXP USA Inc. UJA1065TW/3V3,518	Surface Mount		CAN LIN	32-HTSSOP 32-TSSOP		0.24 in	Exposed Pad	6.1 mm	5.5 V	52 V	Networking
NXP USA Inc. UJA1066TW/5V0/T,51	Surface Mount		SPI	32-HTSSOP 32-TSSOP		0.24 in	Exposed Pad	6.1 mm	3.3 V	5 V	Networking
NXP USA Inc. UJA1066TW/3V3/T	Surface Mount		SPI	32-HTSSOP 32-TSSOP		0.24 in	Exposed Pad	6.1 mm	3.3 V	5 V	Networking
NXP USA Inc. UJA1061TW/3V3/C/T/	Surface Mount	Automotive	CAN LIN	32-HTSSOP 32-TSSOP		0.24 in	Exposed Pad	6.1 mm	5.5 V	27 VDC	Networking
NXP USA Inc. UJA1061TW/5V0/C/T,	Surface Mount	Automotive	CAN LIN	32-HTSSOP 32-TSSOP		0.24 in	Exposed Pad	6.1 mm	5.5 V	27 VDC	Networking
NXP USA Inc. UJA1065TW/5V0,518	Surface Mount		CAN LIN	32-HTSSOP 32-TSSOP		0.24 in	Exposed Pad	6.1 mm	5.5 V	52 V	Networking
NXP USA Inc. UJA1065TW/5V0/512	Surface Mount	Automotive	SPI Serial	32-HTSSOP 32-TSSOP		0.24 in	Exposed Pad	6.1 mm	5.5 V	52 V	Networking

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3D models and CAD resources for this part

Technical documentation and resources