60-9513-10

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Aries Electronics

CONN IC DIP SOCKET 60POS GOLD

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60-9513-10

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Aries Electronics

CONN IC DIP SOCKET 60POS GOLD

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Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	48	$ 9.65

Description

General part information

60-9513 Series

60 (2 x 30) Pos DIP, 0.9" (22.86mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources

Datasheet

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	60-9513-10	60-9513 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Tin	Tin, Gold
Contact Finish Thickness - Mating	10 çin	10 çin
Contact Finish Thickness - Mating	0.25 çm	0.25 çm
Contact Finish Thickness - Post	200 µin	10 - 200 µin
Contact Finish Thickness - Post	5.08 µm	0.25 - 5.08 µm
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post [custom]	Brass	Brass
Current Rating (Amps)	3 A	3 A
Features	Closed Frame	Closed Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole
Number of Positions or Pins (Grid)	60	60
Number of Positions or Pins (Grid) [custom]	30	30
Number of Positions or Pins (Grid) [custom]	2	2
Operating Temperature [Max]	105 ░C	105 ░C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length	3.18 mm	3.18 mm
Termination Post Length	0.125 in	0.125 in
Type	22.86 mm	22.86 mm
Type	DIP	DIP
Type	0.9 in	0.9 in

60-9513 Series

CONN IC DIP SOCKET 60POS GOLD

Part	Current Rating (Amps)	Features	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Type	Type	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Operating Temperature [Max]	Operating Temperature [Min]	Housing Material	Contact Finish - Mating	Termination	Material Flammability Rating	Termination Post Length	Termination Post Length	Contact Finish - Post	Contact Material - Post [custom]	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating
Aries Electronics 60-9513-10H	3 A	Closed Frame	2.54 mm	0.1 in	200 µin	5.08 µm	22.86 mm	DIP	0.9 in	Beryllium Copper	0.1 in	2.54 mm	60	30	2	105 ░C	-55 °C	Glass Filled, Nylon 4/6, Polyamide (PA46)	Gold	Solder	UL94 V-0	3.18 mm	0.125 in	Tin	Brass	Through Hole	10 çin	0.25 çm
Aries Electronics 60-9513-10T	3 A	Closed Frame	2.54 mm	0.1 in	200 µin	5.08 µm	22.86 mm	DIP	0.9 in	Beryllium Copper	0.1 in	2.54 mm	60	30	2	105 ░C	-55 °C	Glass Filled, Nylon 4/6, Polyamide (PA46)	Gold	Solder	UL94 V-0	3.18 mm	0.125 in	Tin	Brass	Through Hole	10 çin	0.25 çm
Aries Electronics 60-9513-10	3 A	Closed Frame	2.54 mm	0.1 in	200 µin	5.08 µm	22.86 mm	DIP	0.9 in	Beryllium Copper	0.1 in	2.54 mm	60	30	2	105 ░C	-55 °C	Glass Filled, Nylon 4/6, Polyamide (PA46)	Gold	Solder	UL94 V-0	3.18 mm	0.125 in	Tin	Brass	Through Hole	10 çin	0.25 çm
Aries Electronics 60-9513-11H	3 A	Closed Frame	2.54 mm	0.1 in	10 çin	0.25 çm	22.86 mm	DIP	0.9 in	Beryllium Copper	0.1 in	2.54 mm	60	30	2	105 ░C	-55 °C	Glass Filled, Nylon 4/6, Polyamide (PA46)	Gold	Solder	UL94 V-0	3.18 mm	0.125 in	Gold	Brass	Through Hole	10 çin	0.25 çm
Aries Electronics 60-9513-11	3 A	Closed Frame	2.54 mm	0.1 in	10 çin	0.25 çm	22.86 mm	DIP	0.9 in	Beryllium Copper	0.1 in	2.54 mm	60	30	2	105 ░C	-55 °C	Glass Filled, Nylon 4/6, Polyamide (PA46)	Gold	Solder	UL94 V-0	3.18 mm	0.125 in	Gold	Brass	Through Hole	10 çin	0.25 çm