Specification	LPC54S018JET180Y

A/D Channels	12 count
A/D Resolution (bits)	12 bit
Connectivity	UART, USB, Ethernet, SDIO, EMI, SD, MMC, USART, I2C, CANbus, SmartCard, SPI, SPIFI, EBI
Converter Architecture	SAR
Core Processor	ARM® Cortex®-M4
Core Size (Bit Width)	32 Bit
Mounting Type	Surface Mount
Number of I/O	145
Operating Temperature (Max)	105 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	Internal, External
Package / Case	180-TFBGA
Package Length	12 mm
Package Name	180-TFBGA
Package Width	12 mm
Peripherals	WDT, POR, LCD, Reset, I2S, Brown-out Detect, PWM, DMA
Program Memory Type	ROMless
RAM Size Depth	360 K
RAM Size Width	8 bit
Speed	180 MHz
Voltage - Supply (Vcc/Vdd) Maximum	3.6 V
Voltage - Supply (Vcc/Vdd) Minimum	1.71 V

LPC54Sxx Series

Part	Peripherals	Mounting Type	Operating Temperature (Max)	Operating Temperature (Min)	Number of I/O	Package Width	Package Name	Package Length	RAM Size Depth	RAM Size Width	A/D Channels	Converter Architecture	A/D Resolution (bits)	Speed	Program Memory Type	Core Processor	Connectivity	Voltage - Supply (Vcc/Vdd) Minimum	Voltage - Supply (Vcc/Vdd) Maximum	Core Size (Bit Width)	Oscillator Type	Package / Case
NXP USA Inc. LPC54S018JET180Y	Brown-out Detect DMA I2S LCD POR PWM Reset WDT	Surface Mount	105 °C	-40 °C	145	12 mm	180-TFBGA	12 mm	360 K	8 bit	12 count	SAR	12 bit	180 MHz	ROMless	ARM® Cortex®-M4	CANbus EBI EMI Ethernet I2C MMC SD SDIO SmartCard SPI SPIFI UART USART USB	1.71 V	3.6 V	32 Bit	External Internal	180-TFBGA

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