Specification	4901-454G

Composition Elements	Sn, Cu
Composition Formula	Sn99.3Cu0.7
Cu Composition	0.7 %
Diameter	0.032 in
Form	Spool
Form Weight	1 lb
Melting Point	442 °F
Process	Lead Free
Shelf Life	120 Months
Shelf Life Start	Date of Manufacture
Sn Composition	99.3 %
Storage/Refrigeration Temperature (Maximum)	86 °F
Storage/Refrigeration Temperature (Minimum)	50 °F
Type	Wire Solder
Wire Gauge	20 AWG, 21 SWG

4901 Series

Part	Shelf Life Start	Wire Gauge	Process	Sn Composition	Composition Formula	Composition Elements	Cu Composition	Melting Point	Form Weight	Form	Storage/Refrigeration Temperature (Maximum)	Storage/Refrigeration Temperature (Minimum)	Shelf Life	Diameter	Type
MG Chemicals 4901-454G	Date of Manufacture	20 AWG 21 SWG	Lead Free	99.3 %	Sn99.3Cu0.7	Cu Sn	0.7 %	442 °F	1 lb	Spool	86 °F	50 °F	120 Months	0.032 in	Wire Solder

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