Specification	ES2BAL

Capacitance	18 pF
Current - Average Rectified (Io)	2 A
Current - Reverse Leakage	1 µA
Mounting Type	Surface Mount
Operating Temperature - Junction (Max)	150 °C
Operating Temperature - Junction (Min)	-55 °C
Package / Case	DO-221AC, SMA Flat Leads
Package Name	Thin SMA
Reverse Recovery Time (trr)	35 ns
Speed - Fast Recovery (Maximum)	500 ns
Speed - Fast Recovery (Minimum)	200 mA
Technology	Standard
Voltage - DC Reverse (Vr) (Max)	100 V
Voltage - Forward (Vf) (Max)	950 mV

ES2B Series

Part	Voltage - Forward (Vf) (Max)	Voltage - DC Reverse (Vr) (Max)	Package Name	Current - Reverse Leakage	Package / Case	Mounting Type	Reverse Recovery Time (trr)	Operating Temperature - Junction (Max)	Operating Temperature - Junction (Min)	Capacitance	Speed - Fast Recovery (Maximum)	Speed - Fast Recovery (Minimum)	Technology	Current - Average Rectified (Io)	Grade	Qualification
Taiwan Semiconductor Corporation ES2BAL	950 mV	100 V	Thin SMA	1 µA	DO-221AC SMA Flat Leads	Surface Mount	35 ns	150 °C	-55 °C	18 pF	500 ns	200 mA	Standard	2 A
Taiwan Semiconductor Corporation ES2BHM4G	950 mV	100 V	DO-214AA (SMB)	10 µA	DO-214AA SMB	Surface Mount	35 ns	150 °C	-55 °C	25 pF	500 ns	200 mA	Standard	2 A	Automotive	AEC-Q101
Taiwan Semiconductor Corporation ES2BA M2G	950 mV	100 V	DO-214AC (SMA)	10 µA	DO-214AC SMA	Surface Mount	35 ns	150 °C	-55 °C	25 pF	500 ns	200 mA	Standard	2 A
Taiwan Semiconductor Corporation ES2BFS	950 mV	100 V	SOD-128	1 µA	SOD-128	Surface Mount	35 ns	150 °C	-55 °C	18 pF	500 ns	200 mA	Standard	2 A