BWHP00231715R56G00

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Pulse Electronics

RF INDUCTORS - SMD CHILISIN RF INDUCTOR WIRE WOUND-STD

BWHP00231715R56G00

Active

Pulse Electronics

RF INDUCTORS - SMD CHILISIN RF INDUCTOR WIRE WOUND-STD

Description Specifications Series Pricing CAD Documents

Description

General part information

BWHP Series

RF Inductors - SMD Chilisin RF inductor Wire Wound-STD

Technical Specifications

Parameters and characteristics for this part

Specification	BWHP00231715R56G00

Current Rating	0.24 A
DC Resistance (DCR) (Max)	2.067 Ohm
Frequency - Self Resonant	550 MHz
Height - Seated (Max)	0.06 in
Inductance	560 nH
Inductance Frequency - Test	25 MHz
Material - Core	Ceramic
Mounting Type	Surface Mount
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-40 °C
Package / Case	0805 (2012 Metric)
Package Name	0805
Q	46
Shielding	Unshielded
Size / Dimension Length	0.093 in
Size / Dimension Width	0.068 in
Tolerance	2 %
Type	Drum Core, Wirewound

BWHP Series

RF Inductors - SMD Chilisin RF inductor Wire Wound-STD

Part	Material - Core	Frequency - Self Resonant	Current Rating	Inductance Frequency - Test	Type	Height - Seated (Max)	Mounting Type	Q	Inductance	Shielding	Tolerance	Package Name	Package / Case	DC Resistance (DCR) (Max)	Size / Dimension Width	Size / Dimension Length	Operating Temperature (Max)	Operating Temperature (Min)
Pulse Electronics BWHP0023171511NJ00	Ceramic	4.75 GHz	1.6 A	250 MHz	Drum Core Wirewound	0.06 in	Surface Mount	93	11 nH	Unshielded	5 %	0805	0805 (2012 Metric)	39 mOhm	0.068 in	0.093 in	125 °C	-40 °C
Pulse Electronics BWHP001107062N4C00	Ceramic	14 GHz	2 A	250 MHz	Drum Core Wirewound	0.026 in	Surface Mount	25	2.4 nH	Unshielded	0.2 nH	0402	0402 (1005 Metric)	45 mOhm	0.028 in	0.043 in	125 °C	-40 °C
Pulse Electronics BWHP0016100872NH00	Ceramic	1.9 GHz	0.55 A	150 MHz	Drum Core Wirewound	0.04 in	Surface Mount	37	72 nH	Unshielded	3 %	0603	0603 (1608 Metric)	420 mOhm	0.039 in	0.063 in	125 °C	-40 °C
Pulse Electronics BWHP0016100815NJ00	Ceramic	3.6 GHz	1.2 A	250 MHz	Drum Core Wirewound	0.04 in	Surface Mount	42	15 nH	Unshielded	5 %	0603	0603 (1608 Metric)	110 mOhm	0.039 in	0.063 in	125 °C	-40 °C
Pulse Electronics BWHP0016100811NH00	Ceramic	4.1 GHz	1.4 A	250 MHz	Drum Core Wirewound	0.04 in	Surface Mount	41	11 nH	Unshielded	3 %	0603	0603 (1608 Metric)	86 mOhm	0.039 in	0.063 in	125 °C	-40 °C
Pulse Electronics BWHP0016100827NJ00	Ceramic	2.8 GHz	780 mA	250 MHz	Drum Core Wirewound	0.04 in	Surface Mount	42	27 nH	Unshielded	5 %	0603	0603 (1608 Metric)	200 mOhm	0.039 in	0.063 in	125 °C	-40 °C
Pulse Electronics BWHP00231715R56G00	Ceramic	550 MHz	0.24 A	25 MHz	Drum Core Wirewound	0.06 in	Surface Mount	46	560 nH	Unshielded	2 %	0805	0805 (2012 Metric)	2.067 Ohm	0.068 in	0.093 in	125 °C	-40 °C
Pulse Electronics BWHP001610082N2J00	Ceramic	15 GHz	900 mA	250 MHz	Drum Core Wirewound	0.04 in	Surface Mount	13	2.2 nH	Unshielded	5 %	0603	0603 (1608 Metric)	182 mOhm	0.039 in	0.063 in	125 °C	-40 °C
Pulse Electronics BWHP001107065N6J00	Ceramic	6.8 GHz	1.6 A	250 MHz	Drum Core Wirewound	0.026 in	Surface Mount	28	5.6 nH	Unshielded	5 %	0402	0402 (1005 Metric)	70 mOhm	0.028 in	0.043 in	125 °C	-40 °C
Pulse Electronics BWHP001107064N7G00	Ceramic	6.85 GHz	1.5 A	250 MHz	Drum Core Wirewound	0.026 in	Surface Mount	18	4.7 nH	Unshielded	2 %	0402	0402 (1005 Metric)	115 mOhm	0.028 in	0.043 in	125 °C	-40 °C

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

BWHP00231715R56G00 | Datasheet