BDN15-3CB/A01

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Tusonix a Subsidiary of CTS Electronic Components

HEATSINK CPU W/ADHESIVE 1.51"SQ

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Tusonix a Subsidiary of CTS Electronic Components

HEATSINK CPU W/ADHESIVE 1.51"SQ

Technical Specifications

Parameters and characteristics for this part

Specification	BDN15-3CB/A01

Attachment Method	Thermal Tape, Adhesive (Included)
Fin Height	9.02 mm
Fin Height	0.355 in
Length [x]	38.35 mm
Length [x]	1.51 in
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	ASIC, BGA, LGA, CPU
Shape	Square, Pin Fins
Shelf Life	24 Months
Thermal Resistance @ Forced Air Flow	400 LFM, 4.5 °C/W
Thermal Resistance @ Natural	15.1 °C/W
Type	Top Mount
Width [x]	38.35 mm
Width [x]	1.51 in

Part	Package Cooled	Shelf Life	Type	Material Finish	Material	Thermal Resistance @ Natural	Fin Height	Fin Height	Thermal Resistance @ Forced Air Flow	Attachment Method	Length [x]	Length [x]	Shape	Width [x]	Width [x]
Tusonix a Subsidiary of CTS Electronic Components BDN15-3CB/A01	ASIC BGA CPU LGA	24 Months	Top Mount	Black Anodized	Aluminum	15.1 °C/W	9.02 mm	0.355 in	4.5 °C/W 400 LFM	Thermal Tape Adhesive (Included)	38.35 mm	1.51 in	Pin Fins Square	38.35 mm	1.51 in

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	1000	$ 2.76

General part information

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount

Technical documentation and resources