DS3112N+
ActiveAnalog Devices Inc./Maxim Integrated
IC MUX TEMPE T3/E3 256-BGA
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DS3112N+
ActiveAnalog Devices Inc./Maxim Integrated
IC MUX TEMPE T3/E3 256-BGA
Deep-Dive with AI
Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | DS3112N+ | DS3112 Series |
|---|---|---|
| Current - Supply | - | 150 mA |
| Interface | - | Parallel/Serial |
| Mounting Type | - | Surface Mount |
| null | - | |
| Operating Temperature | - | 70 - 85 °C |
| Operating Temperature | - | -40 - 0 °C |
| Package / Case | - | 256-BGA |
| Supplier Device Package | - | 256-PBGA (27x27) |
| Voltage - Supply | - | 3.465 V |
| Voltage - Supply | - | 3.135 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tray | 3 | $ 118.38 | |
DS3112 Series
IC TELECOM INTERFACE 256BGA
| Part | Mounting Type | Voltage - Supply [Max] | Voltage - Supply [Min] | Interface | Operating Temperature [Max] | Operating Temperature [Min] | Supplier Device Package | Package / Case | Current - Supply |
|---|---|---|---|---|---|---|---|---|---|
Analog Devices Inc./Maxim Integrated DS3112N+W | Surface Mount | 3.465 V | 3.135 V | Parallel/Serial | 85 °C | -40 °C | 256-PBGA (27x27) | 256-BGA | 150 mA |
Analog Devices Inc./Maxim Integrated DS3112N+ | |||||||||
Analog Devices Inc./Maxim Integrated DS3112 | Surface Mount | 3.465 V | 3.135 V | Parallel/Serial | 70 °C | 0 °C | 256-PBGA (27x27) | 256-BGA | 150 mA |
Analog Devices Inc./Maxim Integrated DS3112D1 | Surface Mount | 3.465 V | 3.135 V | Parallel/Serial | 70 °C | 0 °C | 256-PBGA (27x27) | 256-BGA | 150 mA |
Analog Devices Inc./Maxim Integrated DS3112+ | Surface Mount | 3.465 V | 3.135 V | Parallel/Serial | 70 °C | 0 °C | 256-PBGA (27x27) | 256-BGA | 150 mA |
Description
General part information
DS3112 Series
Telecom IC
Documents
Technical documentation and resources
No documents available