28-516-11S

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Aries Electronics

CONN IC DIP SOCKET ZIF 28POS GLD

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Aries Electronics

CONN IC DIP SOCKET ZIF 28POS GLD

Technical Specifications

Parameters and characteristics for this part

Specification	28-516-11S

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	10 çin
Contact Finish Thickness - Post	0.25 çm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	28
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.15 in
Termination Post Length	3.81 mm
Type	ZIF (ZIP), DIP

Part	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Type	Pitch - Post	Pitch - Post	Current Rating (Amps)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Mounting Type	Contact Material - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination Post Length	Termination Post Length	Contact Finish - Post	Housing Material	Termination	Contact Material - Mating	Number of Positions or Pins (Grid)	Contact Finish - Mating
Aries Electronics 28-516-11S	UL94 V-0	0.1 in	2.54 mm	DIP ZIF (ZIP)	2.54 mm	0.1 in	1 A	10 çin	0.25 çm	Closed Frame	Through Hole	Beryllium Copper	10 çin	0.25 çm	0.15 in	3.81 mm	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder	Beryllium Copper	28	Gold

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	39	$ 13.82

General part information

28 (2 x 14) Pos DIP, ZIF (ZIP) Socket Gold Through Hole

Technical documentation and resources