714-43-220-31-018000

Active

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 20POS GOLD

714-43-220-31-018000

Active

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 20POS GOLD

Description Specifications Series Pricing CAD Documents

Description

General part information

714-43 Series

20 (2 x 10) Pos DIP, 0.1" (2.54mm) Row Spacing Socket Gold Through Hole

Technical Specifications

Parameters and characteristics for this part

Specification	714-43-220-31-018000

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 µin
Contact Finish Thickness - Post	30 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass Alloy
Current Rating	3 A
Features	Closed Frame, Carrier
Grid Columns	10
Grid Rows	2
Housing Material	Polycyclohexylenedimethylene Terephthalate, PCT, Polyester
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	20
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.17 in
Type	0.1" (2.54mm) Row Spacing, DIP

714-43 Series

...

Part	Mounting Type	Contact Finish Thickness - Mating	Housing Material	Features	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Current Rating	Contact Finish - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Post	Contact Material - Post	Contact Material - Mating	Termination Post Length	Type	Operating Temperature (Max)	Operating Temperature (Min)	Termination	Contact Finish - Mating	Number of Rows	Fastening Type	Number of Positions Loaded	Insulation Color	Style	Connector Type	Contact Length - Post	Contact Type	Number of Positions	Insulation Material	Contact Material	Contact Shape	Row Spacing - Mating
Mill-Max Manufacturing Corp. 714-43-252-31-018000	Through Hole	30 µin	PCT Polycyclohexylenedimethylene Terephthalate Polyester	Carrier Closed Frame	26	52	2	3 A	Gold	30 µin	0.1 in	0.1 in	Brass Alloy	Beryllium Copper	0.17 in	0.1" (2.54mm) Row Spacing DIP	125 °C	-55 °C	Solder	Gold
Mill-Max Manufacturing Corp. 714-43-220-31-018000	Through Hole	30 µin	PCT Polycyclohexylenedimethylene Terephthalate Polyester	Carrier Closed Frame	10	20	2	3 A	Gold	30 µin	0.1 in	0.1 in	Brass Alloy	Beryllium Copper	0.17 in	0.1" (2.54mm) Row Spacing DIP	125 °C	-55 °C	Solder	Gold
Mill-Max Manufacturing Corp. 714-43-113-31-007000	Through Hole	30 µin		Carrier				3 A	Tin	200 µin	0.1 in						125 °C	-55 °C	Solder	Gold	1	Push-Pull	All	Black	Board	Receptacle	0.115 in	Female Socket	13	Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Beryllium Copper	Circular
Mill-Max Manufacturing Corp. 714-43-118-31-007000	Through Hole	30 µin		Carrier				3 A	Tin	200 µin	0.1 in						125 °C	-55 °C	Solder	Gold	1	Push-Pull	All	Black	Board	Receptacle	0.115 in	Female Socket	18	Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Beryllium Copper	Circular
Mill-Max Manufacturing Corp. 714-43-161-41-001000	Through Hole	30 µin		Carrier				3 A	Tin	200 µin	0.1 in						125 °C	-55 °C	Solder	Gold	1	Push-Pull	All	Black	Board	Receptacle	0.134 in	Female Socket	61	Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Beryllium Copper	Circular
Mill-Max Manufacturing Corp. 714-43-248-31-007000	Through Hole	30 µin		Carrier				3 A	Tin	200 µin	0.1 in						125 °C	-55 °C	Solder	Gold	2	Push-Pull	All	Black	Board	Receptacle	0.115 in	Female Socket	48	Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Beryllium Copper	Circular	0.1 in
Mill-Max Manufacturing Corp. 714-43-246-31-018000	Through Hole	30 µin	PCT Polycyclohexylenedimethylene Terephthalate Polyester	Carrier Closed Frame	23	46	2	3 A	Gold	30 µin	0.1 in	0.1 in	Brass Alloy	Beryllium Copper	0.17 in	0.1" (2.54mm) Row Spacing DIP	125 °C	-55 °C	Solder	Gold
Mill-Max Manufacturing Corp. 714-43-136-41-001000	Through Hole	30 µin		Carrier				3 A	Tin	200 µin	0.1 in						125 °C	-55 °C	Solder	Gold	1	Push-Pull	All	Black	Board	Receptacle	0.134 in	Female Socket	36	Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Beryllium Copper	Circular
Mill-Max Manufacturing Corp. 714-43-103-31-007000	Through Hole	30 µin		Carrier				3 A	Tin	200 µin	0.1 in						125 °C	-55 °C	Solder	Gold	1	Push-Pull	All	Black	Board	Receptacle	0.115 in	Female Socket	3	Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Beryllium Copper	Circular
Mill-Max Manufacturing Corp. 714-43-145-31-012000	Through Hole	30 µin		Carrier				3 A	Tin	200 µin	0.1 in						125 °C	-55 °C	Solder	Gold	1	Push-Pull	All	Black	Board	Receptacle	0.118 in	Female Socket	45	Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Beryllium Copper	Circular

Pricing

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