
MP23DB01HPTR
ActiveAUDIO CONTROL, MEMS MICROPHONE, 1.6 V TO 3.6 V, RHLGA-5, -40 °C TO 85 °C
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MP23DB01HPTR
ActiveAUDIO CONTROL, MEMS MICROPHONE, 1.6 V TO 3.6 V, RHLGA-5, -40 °C TO 85 °C
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Technical Specifications
Parameters and characteristics for this part
| Specification | MP23DB01HPTR |
|---|---|
| Current - Supply | 800 çA |
| Direction | Omnidirectional |
| Frequency Range [Max] | 10 kHz |
| Frequency Range [Min] | 20 Hz |
| Height (Max) [Max] | 1.08 mm |
| Height (Max) [Max] | 0.043 in |
| Output Type | PDM, Digital |
| Port Location | Bottom |
| S/N Ratio | 64 dB |
| Sensitivity | -24 dB |
| Shape | Rectangular |
| Size / Dimension [x] | 0.138 " |
| Size / Dimension [x] | 3.5 mm |
| Size / Dimension [y] | 0.104 in |
| Size / Dimension [y] | 2.65 mm |
| Termination | Solder Pads |
| Type | MEMS (Silicon) |
| Voltage - Rated | 1.8 V |
| Voltage Range [Max] | 3.6 V |
| Voltage Range [Min] | 1.6 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 2.17 | |
| 10 | $ 1.80 | |||
| 25 | $ 1.66 | |||
| 50 | $ 1.56 | |||
| 100 | $ 1.47 | |||
| 250 | $ 1.36 | |||
| 500 | $ 1.26 | |||
| 1000 | $ 1.22 | |||
| Digi-Reel® | 1 | $ 2.17 | ||
| 10 | $ 1.80 | |||
| 25 | $ 1.66 | |||
| 50 | $ 1.56 | |||
| 100 | $ 1.47 | |||
| 250 | $ 1.36 | |||
| 500 | $ 1.26 | |||
| 1000 | $ 1.22 | |||
| Tape & Reel (TR) | 5000 | $ 1.22 | ||
| Newark | Each (Supplied on Cut Tape) | 1 | $ 2.84 | |
| 10 | $ 2.44 | |||
| 25 | $ 2.30 | |||
| 50 | $ 2.20 | |||
| 100 | $ 2.11 | |||
| 250 | $ 2.00 | |||
| 500 | $ 1.92 | |||
| 1000 | $ 1.84 | |||
Description
General part information
STEVAL-MIC006V1 Series
The MP23DB01HP is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface with optional stereo configuration.
The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to producing audio sensors.
The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format.
Documents
Technical documentation and resources