RB715FM-40FHT106
ActiveRohm Semiconductor
40V 30MA, CATHODE COMMON, SOT-323, ULTRA LOW VFSCHOTTKY BARRIER DIODE FOR AUTOMOTIVE (AEC-Q101 QUALIFIED)
RB715FM-40FHT106
ActiveRohm Semiconductor
40V 30MA, CATHODE COMMON, SOT-323, ULTRA LOW VFSCHOTTKY BARRIER DIODE FOR AUTOMOTIVE (AEC-Q101 QUALIFIED)
Description
General part information
RB715 Series
ROHM's schottky barrier diodes are low VF, low IR and high ESD resistant, suitable for phone and various portable electronics.
Technical Specifications
Parameters and characteristics for this part
| Specification | RB715FM-40FHT106 |
|---|---|
| Current - Average Rectified (Io) (per Diode) | 30 mA |
| Current - Reverse Leakage | 1 µA |
| Diode Configuration | Common Cathode |
| Diode Pair Count | 1 pair |
| Grade | Automotive |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction | 150 °C |
| Package / Case | SC-70, SOT-323 |
| Package Name | SOT-323 |
| Qualification | AEC-Q101 |
| Speed | Any Speed, Small Signal |
| Speed - Fast Recovery (Maximum) | 200 mA |
| Speed - Small Signal Current Max | 200 mA, 200 mA, 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 40 V |
| Voltage - Forward (Vf) (Max) | 370 mV |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
How to Use LTspice® Models
Power Loss and Thermal Design of Diodes
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
How to Use LTspice® Models: Tips for Improving Convergence
How to Use the Thermal Resistance and Thermal Characteristics Parameters
About Flammability of Materials
Explanation for Marking
Diode Types and Applications
Moisture Sensitivity Level - Diodes
Notes for Calculating Power Consumption:Static Operation
Taping Information
Basics of Thermal Resistance and Heat Dissipation
ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment
Impedance Characteristics of Bypass Capacitor
Judgment Criteria of Thermal Evaluation
Notes for Temperature Measurement Using Forward Voltage of PN Junction
About Export Regulations
Package Dimensions
Condition of Soldering / Land Pattern Reference
Diode Selection Method for Asynchronous Converter
Part Explanation
Reliability Test Result
Measurement Method and Usage of Thermal Resistance RthJC
How to Select Rectifier Diodes
PCB Layout Thermal Design Guide
What Is Thermal Design
Two-Resistor Model for Thermal Simulation
Notes for Temperature Measurement Using Thermocouples
Compliance of the RoHS directive
List of Diode Package Thermal Resistance
Method for Monitoring Switching Waveform
Certificate of not containing SVHC under REACH Regulation
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Absolute Maximum Rating and Electrical Characteristics of Diodes
What is a Thermal Model? (Diode)
How to Select Reverse Current Protection Diodes for LDO Regulators
Anti-Whisker formation - Diodes
Precautions When Measuring the Rear of the Package with a Thermocouple
Importance of Probe Calibration When Measuring Power: Deskew
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
