SSW-137-01-S-D
ActiveSamtec Inc.
CONN RCPT 74POS 0.1 GOLD PCB
Deep-Dive with AI
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SSW-137-01-S-D
ActiveSamtec Inc.
CONN RCPT 74POS 0.1 GOLD PCB
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | SSW-137-01-S-D |
|---|---|
| Connector Type | Receptacle |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 30 Áin |
| Contact Finish Thickness - Mating | 0.76 Ám |
| Contact Length - Post | 0.104 in |
| Contact Length - Post | 2.64 mm |
| Contact Material | Phosphor Bronze |
| Contact Shape | Square |
| Contact Type | Forked |
| Current Rating (Amps) | 4.7 A |
| Fastening Type | Push-Pull |
| Insulation Color | Black |
| Insulation Height | 0.335 " |
| Insulation Height | 8.51 mm |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions | 74 |
| Number of Positions Loaded | All |
| Number of Rows | 2 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Row Spacing - Mating [x] | 2.54 mm |
| Row Spacing - Mating [x] | 0.1 in |
| Style | Board to Board, Cable |
| Termination | Solder |
SSW-137 Series
| Part | Material Flammability Rating | Insulation Material | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Contact Length - Post [x] | Contact Length - Post [x] | Contact Material | Mounting Type | Connector Type | Insulation Height | Insulation Height | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Rows | Contact Finish - Post | Contact Type | Contact Finish - Mating | Insulation Color | Fastening Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination | Number of Positions | Contact Shape | Style | Operating Temperature [Min] | Operating Temperature [Max] | Number of Positions Loaded | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Contact Length - Post | Contact Length - Post | Insulation Height [z] | Insulation Height [z] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | UL94 V-0 | Liquid Crystal Polymer (LCP) | 4.7 A | 0.1 in | 2.54 mm | 0.584 " | 14.83 mm | Phosphor Bronze | Through Hole | Receptacle | 0.335 " | 8.51 mm | 0.51 µm | 20 µin | 1 | Gold | Forked | Gold | Black | Push-Pull | 3 µin | 0.076 µm | Solder | 37 | Square | Board to Board Cable | -55 °C | 125 °C | All | ||||||
Samtec Inc. | UL94 V-0 | Liquid Crystal Polymer (LCP) | 4.7 A | 0.1 in | 2.54 mm | Phosphor Bronze | Through Hole | Receptacle | 0.335 " | 8.51 mm | 0.76 Ám | 30 Áin | 2 | Tin | Forked | Gold | Black | Push-Pull | Solder | 74 | Square | Board to Board Cable | -55 °C | 125 °C | All | 2.54 mm | 0.1 in | 0.104 in | 2.64 mm | ||||||
Samtec Inc. | UL94 V-0 | Liquid Crystal Polymer (LCP) | 4.7 A | 0.1 in | 2.54 mm | Phosphor Bronze | Through Hole | Receptacle | 0.335 " | 8.51 mm | 0.51 µm | 20 µin | 2 | Gold | Forked | Gold | Black | Push-Pull | 3 µin | 0.076 µm | Solder | 74 | Square | Board to Board Cable | -55 °C | 125 °C | All | 2.54 mm | 0.1 in | 0.194 in | 4.93 mm | ||||
Samtec Inc. | UL94 V-0 | Liquid Crystal Polymer (LCP) | 4.7 A | 0.1 in | 2.54 mm | Phosphor Bronze | Through Hole | Receptacle | 0.335 " | 8.51 mm | 0.76 Ám | 30 Áin | 2 | Tin | Forked | Gold | Black | Push-Pull | Solder | 74 | Square | Board to Board Cable | -55 °C | 125 °C | All | 2.54 mm | 0.1 in | 0.194 in | 4.93 mm | ||||||
Samtec Inc. | UL94 V-0 | Liquid Crystal Polymer (LCP) | 4.7 A | 0.1 in | 2.54 mm | Phosphor Bronze | Through Hole | Receptacle | 0.335 " | 8.51 mm | 1 | Tin | Forked | Black | Push-Pull | Solder | 37 | Square | Board to Board Cable | -55 °C | 105 ░C | All | 0.104 in | 2.64 mm | |||||||||||
Samtec Inc. | UL94 V-0 | Liquid Crystal Polymer (LCP) | 4.7 A | 0.1 in | 2.54 mm | Phosphor Bronze | Through Hole | Receptacle | 0.335 " | 8.51 mm | 2 | Tin | Forked | Black | Push-Pull | Solder | 74 | Square | Board to Board Cable | -55 °C | 105 ░C | All | 2.54 mm | 0.1 in | 0.104 in | 2.64 mm | |||||||||
Samtec Inc. | UL94 V-0 | Liquid Crystal Polymer (LCP) | 4.7 A | 0.1 in | 2.54 mm | Phosphor Bronze | Through Hole Right Angle | Receptacle | 0.51 µm | 20 µin | 1 | Gold | Forked | Gold | Black | Push-Pull | 3 µin | 0.076 µm | Solder | 37 | Square | Board to Board Cable | -55 °C | 125 °C | All | 0.1 in | 2.54 mm | 0.095 in | 2.41 mm | ||||||
Samtec Inc. | UL94 V-0 | Liquid Crystal Polymer (LCP) | 4.7 A | 0.1 in | 2.54 mm | Phosphor Bronze | Through Hole Right Angle | Receptacle | 0.195 in | 4.95 mm | 2 | Tin | Forked | Black | Push-Pull | Solder | 74 | Square | Board to Board Cable | -55 °C | 105 ░C | All | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | |||||||||
Samtec Inc. | UL94 V-0 | Liquid Crystal Polymer (LCP) | 4.7 A | 0.1 in | 2.54 mm | Phosphor Bronze | Through Hole Right Angle | Receptacle | 0.76 Ám | 30 Áin | 1 | Tin | Forked | Gold | Black | Push-Pull | Solder | 37 | Square | Board to Board Cable | -55 °C | 125 °C | All | 0.1 in | 2.54 mm | 0.095 in | 2.41 mm | ||||||||
Samtec Inc. | UL94 V-0 | Liquid Crystal Polymer (LCP) | 4.7 A | 0.1 in | 2.54 mm | Phosphor Bronze | Through Hole | Receptacle | 0.335 " | 8.51 mm | 0.51 µm | 20 µin | 2 | Gold | Forked | Gold | Black | Push-Pull | 3 µin | 0.076 µm | Solder | 74 | Square | Board to Board Cable | -55 °C | 125 °C | All | 2.54 mm | 0.1 in | 0.104 in | 2.64 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 12.65 | |
| 10 | $ 11.21 | |||
| 100 | $ 9.77 | |||
| 500 | $ 8.33 | |||
| 1000 | $ 7.65 | |||
Description
General part information
SSW-137 Series
74 Position Receptacle Connector 0.100" (2.54mm) Through Hole Gold
Documents
Technical documentation and resources