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7717-16DAPG

7717-16DAPG

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Boyd Laconia, LLC

HEAT SINKS SEMICONDUCTOR PAD FOR TO-18, DAP, 4 LEADS, 5.08MM OUTER DIAMETER, 0.51MM THICK

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7717-16DAPG

7717-16DAPG

Active
Boyd Laconia, LLC

HEAT SINKS SEMICONDUCTOR PAD FOR TO-18, DAP, 4 LEADS, 5.08MM OUTER DIAMETER, 0.51MM THICK

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Description

General part information

Mounting Pads Series

Thermal Interface Products In-Sil-8 Pad for TO220/218/247, Grey, 0.007"Thick, 0.75x0.50", 0.125"Hole Dia.

Technical Specifications

Parameters and characteristics for this part

Specification7717-16DAPG
ColorBlack
Diameter - Outside0.2 in
Height0.02 in
MaterialDialyl Phthalate (DAP)
ShapeCircular
TypeMount
UsageTO-18

Pricing

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