
PMXB65ENEZ
ActiveNexperia USA Inc.
MOSFET N-CH 30V 3.2A DFN1010D-3

PMXB65ENEZ
ActiveNexperia USA Inc.
MOSFET N-CH 30V 3.2A DFN1010D-3
Description
General part information
PMXB65ENE Series
N-channel enhancement mode Field-Effect Transistor (FET) in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
Technical Specifications
Parameters and characteristics for this part
| Specification | PMXB65ENEZ |
|---|---|
| Current - Continuous Drain (Id) (Ta) | 3.2 A |
| Drain to Source Voltage (Vdss) | 30 V |
| Drive Voltage (Max Rds On) | 4.5 V |
| Drive Voltage (Min Rds On) | 10 V |
| FET Type | N-Channel |
| Gate Charge (Max) | 11 nC |
| Input Capacitance (Ciss) (Max) | 295 pF |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 150 °C |
| Operating Temperature (Min) | -55 °C |
| Package / Case | 3-XDFN Exposed Pad |
| Package Name | DFN1010D-3 |
| Power Dissipation (Max) | 8.33 W, 400 mW |
| Rds On (Max) | 0.067 Ohm |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 20 V |
| Vgs(th) (Max) | 2.5 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
plastic, thermal enhanced ultra thin small outline package; 3 terminals; 0.75 mm pitch; 1.1 mm x 1 mm x 0.37 mm body
plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); 3 terminals; 0.75 mm pitch; 1.1 mm x 1 mm x 0.37 mm body
Nexperia package poster
Questions about package outline drawings
LFPAK MOSFET thermal design guide, Chinese version
DFN1010D-3; Reel pack, SMD, 7"; Q2/T3 standard product orientation; Orderable part number ending ,147 or Z; Ordering code (12NC) ending 147
RC Thermal Models
Reflow soldering profile
LFPAK MOSFET thermal design guide - Part 2
Using power MOSFETs in parallel
Thermal performance of DFN packages
Power MOSFET frequently asked questions and answers
Power MOSFET single-shot and repetitive avalanche ruggedness rating