68-PRS11033-12

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Aries Electronics

CONN SOCKET PGA ZIF GOLD

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Aries Electronics

CONN SOCKET PGA ZIF GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	68-PRS11033-12

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating (Amps)	1 A
Features	Closed Frame
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-65 ░C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.18 mm
Termination Post Length	0.125 in
Type	ZIF (ZIP), PGA

CONN SOCKET PGA ZIF GOLD

Part	Current Rating (Amps)	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type	Contact Finish - Post	Termination	Termination Post Length	Termination Post Length	Pitch - Post	Pitch - Post	Type	Operating Temperature [Max]	Operating Temperature [Min]	Pitch - Mating	Pitch - Mating	Features	Contact Material - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Mating	Material Flammability Rating
Aries Electronics 68-PRS11033-12	1 A	Beryllium Copper	30 Áin	0.76 Ám	Through Hole	Tin	Solder	3.18 mm	0.125 in	2.54 mm	0.1 in	PGA, ZIF (ZIP)	125 °C	-65 ░C	0.1 in	2.54 mm	Closed Frame	Beryllium Copper	200 µin	5.08 µm	Gold	UL94 V-0

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	6	$ 74.16

General part information

Pos PGA, ZIF (ZIP) Socket Gold Through Hole

Technical documentation and resources

No documents available