WB30FC120ALZ

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WeEn Semiconductors

WB30FC120AL/NAU000/NO MARK*CHIPS

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Active

WeEn Semiconductors

WB30FC120AL/NAU000/NO MARK*CHIPS

Technical Specifications

Parameters and characteristics for this part

Specification	WB30FC120ALZ

Current - Average Rectified (Io)	30 A
Current - Reverse Leakage @ Vr	250 µA
Mounting Type	Surface Mount
Operating Temperature - Junction	175 °C
Package / Case	Die
Reverse Recovery Time (trr)	65 ns
Speed	200 mA, 500 ns
Supplier Device Package	Wafer
Technology	Standard
Voltage - DC Reverse (Vr) (Max) [Max]	1.2 kV
Voltage - Forward (Vf) (Max) @ If	3.5 V

WB30FC120AL/NAU000/NO MARK*CHIPS

Part	Voltage - DC Reverse (Vr) (Max) [Max]	Current - Average Rectified (Io)	Package / Case	Speed	Operating Temperature - Junction	Current - Reverse Leakage @ Vr	Supplier Device Package	Voltage - Forward (Vf) (Max) @ If	Mounting Type	Reverse Recovery Time (trr)	Technology
WeEn Semiconductors WB30FC120ALZ	1.2 kV	30 A	Die	200 mA, 500 ns	175 °C	250 µA	Wafer	3.5 V	Surface Mount	65 ns	Standard

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	426	$ 1.13

General part information

Diode 1200 V 30A Surface Mount Wafer

Technical documentation and resources

No documents available