BDN14-3CB/A01

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Tusonix a Subsidiary of CTS Electronic Components

HEATSINK CPU W/ADHESIVE 1.41"SQ

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Tusonix a Subsidiary of CTS Electronic Components

HEATSINK CPU W/ADHESIVE 1.41"SQ

Technical Specifications

Parameters and characteristics for this part

Specification	BDN14-3CB/A01

Attachment Method	Thermal Tape, Adhesive (Included)
Fin Height	9.02 mm
Fin Height	0.355 in
Length	35.81 mm
Length	1.41 in
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	ASIC, BGA, LGA, CPU
Shape	Square, Pin Fins
Shelf Life	24 Months
Thermal Resistance @ Forced Air Flow	5.6 °C/W
Thermal Resistance @ Natural	16.2 °C/W
Type	Top Mount
Width [x]	1.41 in
Width [x]	35.81 mm

Part	Material	Type	Attachment Method	Material Finish	Width [x]	Width [x]	Shelf Life	Thermal Resistance @ Natural	Fin Height	Fin Height	Length	Length	Thermal Resistance @ Forced Air Flow	Package Cooled	Shape
Tusonix a Subsidiary of CTS Electronic Components BDN14-3CB/A01	Aluminum	Top Mount	Thermal Tape Adhesive (Included)	Black Anodized	1.41 in	35.81 mm	24 Months	16.2 °C/W	9.02 mm	0.355 in	35.81 mm	1.41 in	5.6 °C/W	ASIC BGA CPU LGA	Pin Fins Square

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount

Technical documentation and resources