RFC02MM2STFTR
ActiveRohm Semiconductor
DIODE GEN PURP 200V 500MA PMDU
RFC02MM2STFTR
ActiveRohm Semiconductor
DIODE GEN PURP 200V 500MA PMDU
Description
General part information
RFC02 Series
RFC02MM2STF is the high reliability automotive fast recovery diode, suitable for General rectification.
Technical Specifications
Parameters and characteristics for this part
| Specification | RFC02MM2STFTR |
|---|---|
| Current - Average Rectified (Io) | 500 mA |
| Current - Reverse Leakage | 1 µA |
| Grade | Automotive |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction (Max) | 150 °C |
| Package / Case | SOD-123F |
| Package Name | PMDU |
| Qualification | AEC-Q101 |
| Reverse Recovery Time (trr) | 35 ns |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Standard |
| Voltage - DC Reverse (Vr) (Max) | 200 V |
| Voltage - Forward (Vf) (Max) | 950 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Absolute Maximum Rating and Electrical Characteristics of Diodes
Importance of Probe Calibration When Measuring Power: Deskew
Diode Types and Applications
Anti-Whisker formation - Diodes
How to Select Rectifier Diodes
PCB Layout Thermal Design Guide
Inner Structure
Method for Monitoring Switching Waveform
Precautions When Measuring the Rear of the Package with a Thermocouple
Notes for Calculating Power Consumption:Static Operation
Report of SVHC under REACH Regulation
Package Dimensions
How to Create Symbols for PSpice Models
How to Select Reverse Current Protection Diodes for LDO Regulators
Compliance of the RoHS directive
Moisture Sensitivity Level - Diodes
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
θ<sub>JA</sub> and Ψ<sub>JT</sub>
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Reliability Test Result
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Taping Information
Two-Resistor Model for Thermal Simulation
Basics of Thermal Resistance and Heat Dissipation
ESD Data
θ<sub>JC</sub> and Ψ<sub>JT</sub>
What Is Thermal Design
How to Use LTspice® Models
How to Use LTspice® Models: Tips for Improving Convergence
Explanation for Marking
What is a Thermal Model? (Diode)
About Export Regulations
About Flammability of Materials
Part Explanation
Notes for Temperature Measurement Using Thermocouples
Impedance Characteristics of Bypass Capacitor
Measurement Method and Usage of Thermal Resistance RthJC
Condition of Soldering / Land Pattern Reference
Judgment Criteria of Thermal Evaluation
List of Diode Package Thermal Resistance
Advantages of PMDE Compact Package with High Heat Dissipation for Automotive Schottky Barrier Diodes
Power Loss and Thermal Design of Diodes
