General part information
Mini-Fit TPA2/Sigma Male Crimp Terminal, Copper Alloy, Post-Plated Gold (Au), 20-18 AWG, 2.10-2.85mm Insulation Diameter, Loose
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Technical documentation and resources
Mini-Fit TPA2/Sigma Male Crimp Terminal, Copper Alloy, Post-Plated Gold (Au), 20-18 AWG, 2.10-2.85mm Insulation Diameter, Loose
| Part | Contact Finish | Wire Gauge (AWG) (Min) | Wire Gauge (AWG) (Max) | Contact Termination | Contact Finish Thickness | Type | Pin or Socket | Wire Gauge |
|---|---|---|---|---|---|---|---|---|
 Molex | Tin | 18 AWG | 20.5 AWG | Crimp | 100 µin | Power | Pin | |
 Molex | Tin | 18 AWG | 20.5 AWG | Crimp | 100 µin | Power | Pin | |
 Molex | Gold | Crimp | 30 µin | Power | Pin | 16 AWG | ||
Molex | Tin | Crimp | 98.4 µin | Power | Pin | 16 AWG | ||
 Molex | Gold | 18 AWG | 20.5 AWG | Crimp | Power | Pin | ||
 Molex | Tin | 18 AWG | 20.5 AWG | Crimp | 100 µin | Power | Pin | |
Molex | Gold | 18 AWG | 20.5 AWG | Crimp | 30 µin | Power | Pin | |
Molex | Gold | 18 AWG | 20.5 AWG | Crimp | Power | Pin | ||
 Molex | ||||||||
Molex | Tin | 22 AWG | 24 AWG | Crimp | 98.4 µin | Power | Pin |
