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TP2502N8-G - C04-029 MB

TP2502N8-G

Active
Microchip Technology

MOSFET, P-CHANNEL ENHANCEMENT-MODE, -20V, 2.0 OHM

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TP2502N8-G - C04-029 MB

TP2502N8-G

Active
Microchip Technology

MOSFET, P-CHANNEL ENHANCEMENT-MODE, -20V, 2.0 OHM

Technical Specifications

Parameters and characteristics commom to parts in this series

SpecificationTP2502N8-GTP2502 Series
Current - Continuous Drain (Id) @ 25°C-630 mA
Drain to Source Voltage (Vdss)-20 V
Drive Voltage (Max Rds On, Min Rds On)-10 V
Drive Voltage (Max Rds On, Min Rds On)-5 V
FET Type-P-Channel
Input Capacitance (Ciss) (Max) @ Vds-125 pF
Mounting Type-Surface Mount
null-
Operating Temperature--55 °C
Operating Temperature-150 °C
Package / Case-TO-243AA
Rds On (Max) @ Id, Vgs-2 Ohm
Supplier Device Package-TO-243AA (SOT-89)
Technology-MOSFET (Metal Oxide)
Vgs (Max)-20 V
Vgs(th) (Max) @ Id-2.4 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.70
25$ 1.40
100$ 1.29
Digi-Reel® 1$ 1.70
25$ 1.40
100$ 1.29
Tape & Reel (TR) 2000$ 1.29
Microchip DirectT/R 1$ 1.70
25$ 1.40
100$ 1.29
1000$ 1.09
5000$ 0.99
10000$ 0.91

TP2502 Series

MOSFET, P-Channel Enhancement-Mode, -20V, 2.0 Ohm

PartOperating Temperature [Min]Operating Temperature [Max]Vgs(th) (Max) @ IdPackage / CaseCurrent - Continuous Drain (Id) @ 25°CSupplier Device PackageMounting TypeFET TypeVgs (Max)Drive Voltage (Max Rds On, Min Rds On) [Max]Drive Voltage (Max Rds On, Min Rds On) [Min]Rds On (Max) @ Id, VgsDrain to Source Voltage (Vdss)TechnologyInput Capacitance (Ciss) (Max) @ Vds [Max]
Microchip Technology
TP2502N8-G
Microchip Technology
TP2502N8-G
-55 °C
150 °C
2.4 V
TO-243AA
630 mA
TO-243AA (SOT-89)
Surface Mount
P-Channel
20 V
10 V
5 V
2 Ohm
20 V
MOSFET (Metal Oxide)
125 pF

Description

General part information

TP2502 Series

This low threshold enhancement-mode (normally-off) transistor utilizes a vertical DMOS structure and well-proven silicon-gate manufacturing process. This combination produces a device with the power handling capabilities of bipolar transistors and with the high input impedance and positive temperature coefficient inherent in MOS devices. Characteristic of all MOS structures, this device is free from thermal runaway and thermally-induced secondary breakdown. Vertical DMOS FETs are ideally suited to a wide range of switching and amplifying applications where very low threshold voltage, high breakdown voltage, high input impedance, low input capacitance, and fast switching speeds are desired.