SPHWHAHDNL271ZU3D3

Samsung Semiconductor, Inc.

LED COB D GEN3 WARM WHT SQ 3500K

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SPHWHAHDNL271ZU3D3

Samsung Semiconductor, Inc.

LED COB D GEN3 WARM WHT SQ 3500K

Deep-Dive with AI

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	SPHWHAHDNL271ZU3D3

CCT (K)	3500 K
Color	White, Warm
Configuration	Square
CRI (Color Rendering Index)	90
Current - Max [Max]	2.76 A
Current - Test	1.08 A
Height [z]	1.5 mm
Lens Type	Flat
Light Emitting Surface (LES) [diameter]	22 mm
Lumens/Watt @ Current - Test	141 lm/W
Luminous Flux @ Current/Temperature	7774 lm
Size / Dimension [x]	28 mm
Size / Dimension [y]	28 mm
Temperature - Test	85 °C
Type	Chip On Board (COB)
Viewing Angle	115 °
Voltage - Forward (Vf) (Typ)	51 V

SPHWHAHDNL271 Series

Part	Type	Temperature - Test	Color	Size / Dimension [y]	Size / Dimension [x]	Viewing Angle	Voltage - Forward (Vf) (Typ)	CCT (K)	Lumens/Watt @ Current - Test	Lens Type	Light Emitting Surface (LES) [diameter]	CRI (Color Rendering Index)	Luminous Flux @ Current/Temperature	Current - Max [Max]	Configuration	Current - Test	Height [z]
Samsung Semiconductor, Inc. SPHWHAHDNL271ZV3D3	Chip On Board (COB)	85 °C	Warm White	28 mm	28 mm	115 °	51 V	3000 K	137 lm/W	Flat	22 mm	90	7549 lm	2.76 A	Square	1.08 A	1.5 mm
Samsung Semiconductor, Inc. SPHWHAHDNL271ZW3D3	Chip On Board (COB)	85 °C	Warm White	28 mm	28 mm	115 °	51 V	2700 K	130 lm/W	Flat	22 mm	90	7177 lm	2.76 A	Square	1.08 A	1.5 mm
Samsung Semiconductor, Inc. SPHWHAHDNL271ZV2D2	Chip On Board (COB)	85 °C	Warm White	28 mm	28 mm	115 °	52 V	3000 K	131 lm/W	Flat	22 mm	90	7352 lm	2.76 A	Square	1.08 A	1.5 mm
Samsung Semiconductor, Inc. SPHWHAHDNL271ZU3D3	Chip On Board (COB)	85 °C	Warm White	28 mm	28 mm	115 °	51 V	3500 K	141 lm/W	Flat	22 mm	90	7774 lm	2.76 A	Square	1.08 A	1.5 mm
Samsung Semiconductor, Inc. SPHWHAHDNL271ZR3D2	Chip On Board (COB)	85 °C	Cool White	28 mm	28 mm	115 °	52 V		139 lm/W	Flat	22 mm	90		2.76 A	Square	1.08 A	1.5 mm
Samsung Semiconductor, Inc. SPHWHAHDNL271ZV3DC	Chip On Board (COB)	85 °C	Warm White	28 mm	28 mm	115 °		3000 K	139 lm/W	Flat	22 mm	90	7579 lm	2.16 A	Square	1.08 A	1.5 mm
Samsung Semiconductor, Inc. SPHWHAHDNL271ZT3D2	Chip On Board (COB)	85 °C	Neutral White	28 mm	28 mm	115 °	52 V	4000 K	137 lm/W	Flat	22 mm	90	7706 lm	2.76 A	Square	1.08 A	1.5 mm
Samsung Semiconductor, Inc. SPHWHAHDNL271ZT2D2	Chip On Board (COB)	85 °C	Neutral White	28 mm	28 mm	115 °	52 V	4000 K	137 lm/W	Flat	22 mm	90	7706 lm	2.76 A	Square	1.08 A	1.5 mm
Samsung Semiconductor, Inc. SPHWHAHDNL271ZR3D3	Chip On Board (COB)	85 °C	Cool White	28 mm	28 mm	115 °	51 V		145 lm/W	Flat	22 mm	90	8002 lm	2.76 A	Square	1.08 A	1.5 mm
Samsung Semiconductor, Inc. SPHWHAHDNL271ZV3DB	Chip On Board (COB)	85 °C	Warm White	28 mm	28 mm	115 °	51.1 V	3000 K		Flat	22 mm	90	9225 lm	2.16 A	Square	1.08 A	1.5 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	320	$ 8.92

Description

General part information

SPHWHAHDNL271 Series

LED Lighting COBs Engines Modules Chip On Board (COB) COB D Gen3 White, Warm Square

Documents

Technical documentation and resources

No documents available