PMEG050T150EPDAZ
ActiveNexperia USA Inc.
SCHOTTKY DIODES & RECTIFIERS 50V, 15 A LOW VF TRENCH MEGA SCHOTTKY BARRIER RECTIFIER
PMEG050T150EPDAZ
ActiveNexperia USA Inc.
SCHOTTKY DIODES & RECTIFIERS 50V, 15 A LOW VF TRENCH MEGA SCHOTTKY BARRIER RECTIFIER
Description
General part information
PMEG050T150EPD Series
Trench Maximum Efficiency General Application (MEGA) Schottky barrier rectifier, encapsulated in a CFP15 (SOT1289) power and flat lead Surface-Mounted Device (SMD) plastic package.
Technical Specifications
Parameters and characteristics for this part
| Specification | PMEG050T150EPDAZ |
|---|---|
| Capacitance | 800 pF |
| Current - Average Rectified (Io) | 15 A |
| Current - Reverse Leakage | 100 µA |
| Grade | Automotive |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction (Max) | 175 °C |
| Package / Case | TO-277, 3-PowerDFN |
| Package Name | CFP15 |
| Qualification | AEC-Q101 |
| Reverse Recovery Time (trr) | 60 ns |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 50 V |
| Voltage - Forward (Vf) (Max) | 550 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
CFP15; Reel pack for SMD, 13"; Q4/T2 product orientation
Wave soldering guidelines for flatpack packages
plastic, thermal enhanced ultra thin SMD package; 3 terminals; 2.13 mm pitch; 5.8 x 4.3 x 0.78 mm body
Nexperia package poster
Schottky rectifiers in CFP packages
Questions about package outline drawings
plastic, thermal enhanced ultra thin SMD package; 3 terminals; 5.8 x 4.3 x 0.78 mm body
Reflow soldering profile
PMEG050T150EPD Nexperia Product Reliability
Evaluation of junction temperature and thermal stacks using the virtual junction
Wave soldering profile
CFP15; Reel pack for SMD, 7"; Q4/T2 product orientation
CFP封装的肖特基整流器